Supercritical Substrate Chamber Pressurization Without Pattern Collapse
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Solution Overview
Problem
Existing substrate processing methods using supercritical fluids face the risk of pattern collapse due to exposure of the substrate surface when a high flow rate processing fluid is introduced, and the time required to reach the necessary pressure is prolonged when the fluid is supplied only from the lower side.
Innovation Solution
A substrate processing method and apparatus that supplies processing fluid from both below and above the substrate once the internal pressure exceeds the critical pressure, ensuring the fluid is in a supercritical state, thereby preventing exposure of the substrate surface and reducing the time to reach the desired pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If processing fluid is supplied only from the lower side of the substrate, then the risk of pattern collapse is reduced, but the time required to reach the necessary pressure is prolonged
Solution Approach 1:
The processing chamber is divided into an upper space and a lower space by the substrate. The processing fluid is supplied separately to both spaces through different supply ports, allowing simultaneous pressure buildup on both sides of the substrate without causing unbalanced forces that would lead to pattern collapse.
Solution Approach 2:
Different supply strategies are applied to different regions: the lower supply port provides fluid to build pressure beneath the substrate, while the upper supply port provides fluid to the upper space. This localized quality control ensures both spaces reach the necessary pressure simultaneously, preventing pattern collapse while reducing total pressurization time.
2Productivity
If high flow rate processing fluid is introduced into the processing chamber, then the processing time is reduced, but the liquid film on the substrate surface is lost causing pattern collapse
Solution Approach 1:
The processing fluid is supplied to both the upper and lower spaces before the substrate processing actually begins. This preliminary action ensures that the pressure is equalized on both sides of the substrate, creating a stable environment that prevents pattern collapse during subsequent high flow rate processing.
Solution Approach 2:
By supplying processing fluid to both the upper and lower spaces, the system creates equipotential conditions where pressure is balanced on both sides of the substrate. This eliminates pressure differentials that would otherwise cause the substrate to deform or collapse during high flow rate processing.
3Reliability
If the amount of processing fluid is increased to avoid processing failures, then the flow rate becomes further higher, but this may cause processing failure due to liquid film loss
Solution Approach 1:
The processing fluid supply is segmented into two separate channels: one for the upper space and one for the lower space. This segmentation allows independent control of fluid amounts in each space, enabling the use of sufficient fluid volume to prevent processing failures while maintaining controlled flow rates that do not cause liquid film loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents processing failures by maintaining the liquid film and reduces the time required to achieve the necessary pressure, enhancing processing efficiency and preventing pattern collapse.
Implementation Method 1
filling the internal space with the processing fluid in a supercritical state
Data Source
AI summary
A substrate processing method of the invention includes accommodating a substrate having an upper surface covered with a liquid film and being placed on a support member having a flat plate-like shape in a horizontal position, into an internal space of a processing chamber, filling the internal space with the processing fluid in a supercritical state, and discharging the processing fluid from the internal space. A first ejection port ejects the processing fluid in a horizontal direction toward a space between a bottom surface among wall surfaces of the processing chamber and a lower surface of the support member. Additionally, after an internal pressure of the internal space exceeds a critical pressure of the processing fluid, a second ejection port ejects the processing fluid in a horizontal direction toward a space between a ceiling surface among the wall surfaces and an upper surface of the substrate.