Supercritical Vessel Flow Layout for Uniform Substrate Processing
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Solution Overview
Problem
Supercritical processing apparatuses face issues with uneven fluid flow and temperature distribution across substrates, leading to pattern leaning and re-attachment of particles due to sudden pressure and temperature changes, as well as turbulence during the processing of integrated circuits.
Innovation Solution
The apparatus features a vessel configuration with inclined guide portions and stepped surfaces to stabilize fluid flow and prevent particle re-attachment, ensuring uniform flow velocity and temperature distribution by varying the flow channel width and using a sealing member to minimize turbulence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If supercritical fluid is introduced from a small diameter fluid hole at high pressure, then the substrate can be effectively treated, but sudden pressure and temperature changes occur causing pattern leaning
Solution Approach 1:
The single fluid hole is divided into multiple fluid holes distributed across the vessel surface. This segmentation distributes the high-pressure fluid introduction across multiple points, preventing sudden localized pressure and temperature changes that cause pattern leaning, while still achieving effective substrate treatment through collective action of multiple holes.
Solution Approach 2:
Fluid holes are strategically positioned at different locations on the vessel surface, including peripheral regions, to create localized treatment zones. This ensures uniform fluid distribution across the substrate surface, preventing concentration of pressure changes in any single area and thereby eliminating pattern leaning while maintaining treatment effectiveness.
2Stress or pressure
If supercritical fluid flows through a narrow gap between vessel and substrate, then high pressure treatment is achieved, but flow velocity difference occurs between central and peripheral regions causing temperature deviation
Solution Approach 1:
The narrow gap flow channel is segmented into multiple parallel flow paths created by distributing fluid holes across the vessel. This segmentation equalizes the flow velocity across different regions (central and peripheral) by providing multiple routes for fluid circulation, thereby preventing temperature deviation while maintaining high pressure treatment conditions.
Solution Approach 2:
The fluid delivery system transitions from a single-point central injection to a distributed two-dimensional array of fluid holes across the vessel surface. This dimensional change creates multiple flow channels that balance the fluid distribution, ensuring uniform velocity and temperature across the substrate while preserving the high-pressure treatment effect.
3Productivity
If fluid is discharged through a single hole, then discharge efficiency is achieved, but turbulence occurs causing removed particles to re-attach to substrate
Solution Approach 1:
The single discharge hole is segmented into multiple discharge holes positioned at different locations on the vessel. This segmentation distributes the discharge flow across multiple points, reducing localized turbulence intensity. The reduced turbulence prevents removed particles from re-attaching to the substrate while collectively maintaining high discharge efficiency through the combined action of multiple holes.
Solution Approach 2:
Discharge holes are positioned in peripheral regions and at specific locations optimized for turbulence reduction. This local positioning strategy creates zones of reduced turbulence near the substrate surface where particles are less likely to re-attach, while the collective discharge from multiple holes maintains overall high discharge efficiency.
4Ease of manufacture
If fluid flow channel width is uniform, then manufacturing simplicity is maintained, but flow velocity uniformity across substrate cannot be achieved
Solution Approach 1:
Instead of manufacturing a complex variable-width flow channel, the system uses multiple uniformly spaced fluid holes with uniform local gap widths. This segmentation approach maintains manufacturing simplicity by using standard uniform dimensions throughout, while achieving flow velocity uniformity across the substrate through the distributed geometry of multiple holes rather than through complex single-channel shaping.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces pattern leaning and enhances reaction uniformity, preventing particle re-attachment and achieving stable fluid flow and discharge, thereby improving processing consistency and reducing defects.
Implementation Method 1
The contaminants may be removed from the substrate by employing supercritical processing... a supercritical fluid such as carbon dioxide (CO2) or the like is supplied to the substrate at a high pressure from a supercritical processing apparatus including a vessel, thus removing residual contaminants including IPA from the substrate
Implementation Method 2
The contaminants may be removed from the substrate by employing supercritical processing
Implementation Method 3
sudden pressure and temperature changes may occur in a central region of the substrate W corresponding to a location of the first fluid hole 11
Data Source
AI summary
A supercritical processing apparatus includes an upper vessel including a first fluid hole formed in a center thereof, and a lower vessel including a second fluid hole formed in a center thereof. A space is defined between the upper and lower vessels and configured to allow a substrate to be placed therein. The upper vessel further includes a first guide portion provided at a lower portion thereof to be gradually inclined downward toward a periphery thereof from the first fluid hole.