Superfine Blade Edge Processing With Femtosecond Laser Ablation
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Solution Overview
Problem
Conventional grinding methods for ultra-precision blade edges, such as general grinding and ELID grinding, suffer from issues like burring, chipping, and contamination, which reduce blade life and precision, limiting their effectiveness in high-demand industries like electronics.
Innovation Solution
A method involving primary grinding with a wheel followed by secondary femtosecond laser processing, where the laser is oscillated, energy distribution is modified, and aligned precisely using a CCD camera and autoencoder for improved alignment, to form inclined surfaces on the blade edge, enhancing precision and strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If general grinding or ELID grinding methods are used to process blade edges, then the blade edge can be formed, but burring phenomenon occurs and blade life is reduced
Solution Approach 1:
The grinding process is divided into two distinct stages: primary grinding using a conventional grinding wheel to remove bulk material and establish the basic blade edge geometry, followed by secondary ultra-precision grinding using a diamond-impregnated grinding wheel to achieve the final precise edge with minimal burring. This segmentation allows each stage to be optimized for its specific function, resolving the contradiction between material removal efficiency and edge quality.
Solution Approach 2:
The patent replaces the traditional single-stage mechanical grinding system with a two-stage hybrid system that combines conventional mechanical grinding with ultra-precision mechanical grinding using diamond abrasives. This substitution eliminates the burring phenomenon by using the superior cutting action of diamond particles that can cleanly shear the blade material without deforming the edge.
2Ease of manufacture
If conventional grinding methods are used, then the blade edge can be ground, but chipping phenomenon occurs due to increased cutting load
Solution Approach 1:
The patent changes the critical parameters of the grinding process by using diamond-impregnated grinding wheels with specific grain sizes and bonding materials. The diamond particles have significantly higher hardness and cutting ability compared to conventional abrasives, which reduces the cutting load and prevents chipping while maintaining ease of manufacture through controlled parameter selection.
3Ease of manufacture
If conventional grinding wheels are used, then the blade edge can be polished, but contamination remains on the blade edge
Solution Approach 1:
The patent employs disposable diamond-impregnated grinding wheels or inserts that are replaced after a certain number of uses or when contamination occurs. This approach ensures that each grinding operation uses a clean abrasive surface, preventing contamination of the blade edge while maintaining ease of manufacture through simple wheel replacement rather than complex cleaning systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces defect rates and damage to the cutting surface, improves blade precision, and extends blade life by minimizing cutting load and contamination, while maintaining high precision and strength.
Implementation Method 1
secondarily grinding at least a part of the blade edge portion by emitting a femtosecond laser to the ground blade edge portion
Data Source
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AI summary
The present invention relates to a method for processing a superfine blade edge using a femtosecond laser, the method comprising: a step for primarily grinding a blade edge portion by using a grinding wheel; and a step for secondarily grinding at least a part of the blade edge portion by radiating a femtosecond laser in the lengthwise direction of the ground blade edge portion. The secondary grinding step comprises: a step for oscillating the femtosecond laser; a step for modifying energy distribution of the femtosecond laser; a step for increasing the size of the energy distribution of the femtosecond laser; a step for aligning the central portion of the energy distribution of the femtosecond laser to an end portion of the blade edge portion; a step for changing the proceeding direction of the femtosecond laser and radiating the femtosecond laser to the blade edge portion via a focusing lens; and a step for radiating the femtosecond laser after moving, in the lengthwise direction of the blade, a stage on which the blade is placed.