Superfine Pattern Material with Crosslinking Treatment for Diffraction Limits

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Solution Overview

Problem

Current exposure equipment is limited by the wavelength of the light source, leading to deformed pattern shapes due to diffraction, affecting subsequent manufacturing processes and device performance in semiconductor and display devices.

Innovation Solution

A material for forming superfine patterns comprising a photosensitive resin composition with specific components and a pattern treatment composition, including an alkali-soluble phenol formaldehyde resin, a sensitizer, a hydroxyl-containing additive, and a crosslinking agent, along with a formation method that involves applying these compositions on a substrate and cleaning with a solvent, to achieve precise pattern formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional exposure equipment is used with existing light sources, then manufacturing process is simplified, but pattern resolution deteriorates due to diffraction effects

Engineering Contradiction:
Improvepattern resolutionVSAvoidexposure equipment complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent changes the chemical composition parameters of the photosensitive resin by incorporating specific additives (amino compound, carboxylic acid compound, and metal compound) to enable the material to form superfine patterns without requiring advanced exposure equipment, thus improving pattern resolution while avoiding equipment complexity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite photosensitive resin system by combining multiple functional components (alkali-soluble phenol formaldehyde resin, amino compound, carboxylic acid compound, metal compound, and solvent) that work synergistically to achieve superfine pattern formation through enhanced chemical reactions during exposure and development

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If photosensitive resin composition is optimized for superfine patterns, then pattern resolution improves, but formulation complexity increases

Engineering Contradiction:
Improvepattern resolutionVSAvoidcomposition formulation complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent segments the photosensitive resin formulation into distinct functional modules: base resin (alkali-soluble phenol formaldehyde resin), sensitizing agents (amino and carboxylic acid compounds), catalysts (metal compounds), and solvents, allowing each component to be optimized independently while maintaining overall system performance for superfine pattern formation

Inventive Principle:
Principle #1Segmentation

3Productivity

If pattern size is reduced to increase integration, then device performance improves, but pattern deformation increases due to diffraction

Engineering Contradiction:
Improvedevice integrationVSAvoidpattern shape accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent converts the harmful diffraction effect into a beneficial chemical amplification mechanism by using the exposed pattern as a template to trigger enhanced crosslinking reactions and selective dissolution, allowing the formation of accurate superfine patterns even when physical optical limits would cause deformation

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables the formation of superfine patterns with good resolution, addressing the limitations of existing technologies and enhancing the precision and quality of semiconductor and display devices.

Implementation Method 1

The first layer includes a photosensitive resin composition (I)... a sensitizer (B)... The second layer includes a pattern treatment composition (II)... a thermal acid generator (P)

Methodology Applied
Scientific EffectPhotochemical reaction: Photopolymerisation

Implementation Method 2

a thermal acid generator (P)... Based on a total usage amount of the pattern treatment composition (II) being 100 parts by weight, a usage amount of the thermal acid generator (P) is 0.02 parts by weight to 0.06 parts by weight

Methodology Applied
Scientific EffectThermal decomposition: Thermolysis

Implementation Method 3

The crosslinking agent (M) includes a melamine-based crosslinking agent... a usage amount of the crosslinking agent (M) is 0.5 parts by weight to 2.5 parts by weight

Methodology Applied
Scientific EffectCrosslinking: Chemical Bonding

Data Source

PatentUS20260050215A1Material for forming superfine pattern, photosensitive resin composition, pattern treatment composition and formation method of superfine pattern
Publication Date: 2026.02.19 ECHEM SOLUTIONS CORP
  • US20260050215A1 patent drawing
  • US20260050215A1 patent drawing
  • US20260050215A1 patent drawing

AI summary

A material for forming a superfine pattern, a photosensitive resin composition, a pattern treatment composition and a formation method of superfine pattern are provided. The material for forming a superfine pattern includes a first layer and a second layer. The first layer includes a photosensitive resin composition (I). The photosensitive resin composition (I) includes an alkali-soluble phenol formaldehyde resin (A), a sensitizer (B), a hydroxyl-containing additive (C) and an organic solvent (D). The second layer includes a pattern treatment composition (II). The pattern treatment composition (II) includes a crosslinking agent (M), a water-soluble resin (N), a thermal acid generator (P) and water (Q). The hydroxyl-containing additive (C) includes a compound represented by following Formula (C-1). The crosslinking agent (M) includes a melamine-based crosslinking agent.In Formula (C-1), the definition of R1 to R4 is the same as defined in the detailed description.