Superimposed Fin and Heat Pipe Layout for Uniform Cooling
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Solution Overview
Problem
Existing cooling devices fail to provide uniform cooling for heat-generating elements with varying heat outputs, as seen in Patent Document 1, where the second heat pipe is separated from the heat sink, leading to inefficient cooling of both heat-generating components.
Innovation Solution
A cooling device design featuring first and second heat pipes thermally connected to heat-radiating fin groups, forming a multilayer structure, where the heat pipes are angled and overlapping to ensure uniform heat distribution across heat-generating elements, with the second heat-radiating fin group receiving heat from either the first or third heat-radiating fin group with greater thermal load to maintain uniform cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the second heat pipe is separated from the heat sink to simplify the structure, then the device complexity is reduced, but the cooling uniformity deteriorates
Solution Approach 1:
The patent merges the second heat pipe with the heat sink by positioning the second end of the second heat pipe at the heat sink, allowing both heat pipes to thermally connect to the same heat-radiating fin groups. This integration enables uniform heat distribution across multiple heat-generating elements while maintaining a relatively simple overall structure.
Solution Approach 2:
The heat sink serves multiple functions by receiving heat from both the first and second heat pipes simultaneously. The heat-radiating fin groups act as a universal thermal management component that cools multiple different heat-generating elements through a shared thermal pathway, improving cooling uniformity without significantly increasing structural complexity.
2Reliability
If multiple heat-radiating fin groups are superimposed to improve heat distribution, then the cooling uniformity is improved, but the device complexity increases
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional superimposed structure by stacking multiple heat-radiating fin groups vertically. The first and second heat-radiating fin groups are positioned at different heights, with heat pipes extending vertically to connect them, enabling uniform heat distribution while consolidating the structure in the vertical dimension.
Solution Approach 2:
The patent implements a nested configuration where the second heat-radiating fin group is superimposed on the first heat-radiating fin group, and the heat pipes are positioned to pass through or between these nested fin groups. This nesting approach maximizes heat transfer surface area within a compact vertical space, improving cooling uniformity without proportionally increasing the device's footprint.
3Productivity
If the heat pipes are positioned at different heights to optimize heat distribution, then the heat dissipation efficiency is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent divides the thermal management system into segmented components with distinct vertical positions: the first heat-radiating fin group at a higher position, the second heat-radiating fin group at a lower position, and heat pipes connecting them at intermediate heights. This segmentation allows each component to be optimized for its specific thermal role while maintaining manageable manufacturing tolerances through modular assembly.
Solution Approach 2:
The patent applies local quality by positioning heat pipes at specific heights that correspond to the thermal requirements of different heat-generating elements. The first heat pipe connects to the first heat-radiating fin group at an optimal height for its associated component, while the second heat pipe connects to the second heat-radiating fin group at a different optimal height, allowing each connection to be precisely positioned for maximum thermal efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures uniform cooling of heat-generating elements by adjusting the area ratio of heat-radiating fins and using angled, overlapping heat pipes to distribute heat effectively, enhancing long-term reliability and heat dissipation efficiency.
Implementation Method 1
a first heat pipe having one end thermally connected to a first heat-generating element and another end thermally connected to a first heat-radiating fin group
Implementation Method 2
heat pipe
Implementation Method 3
heat-radiating fin group that has a plurality of first heat-radiating fins
Implementation Method 4
heat-radiating fin group
Data Source
AI summary
A cooling device includes a heat-radiating fin group having a plurality of heat-radiating fins that are arranged parallel to each other in a first direction; first heat pipes, one end of each first heat pipe being configured to be thermally connected to a first heat-generating element, another end of each first heat pipe being thermally connected to the heat-radiating fin group; and second heat pipes, one end of each second heat pipe being configured to be thermally connected to a second heat-generating element, another end of each second heat pipe being thermally connected to the heat-radiating fin group, wherein respective inserted another ends of the first and second heat pipes are disposed on a plane parallel to the first direction and defined in the heat-radiating fin group and have portions parallel to the first direction.