Superimposed Lead Circuit Device for High Current Switching
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Solution Overview
Problem
Conventional hybrid integrated circuit devices face challenges in downsizing when handling high current switching due to the need for wide conductive patterns, which increases the device size and risks short circuits between the circuit board and conductive patterns.
Innovation Solution
The circuit device features two leads connected to the semiconductor element, with one lead superimposed on the other, reducing the area occupied on the circuit board and eliminating the need for a conductive pattern on the board surface, thereby enabling downsizing and preventing short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the width of the conductive pattern is widened to secure large current capacity, then the current handling capacity is improved, but the device size increases
Solution Approach 1:
The patent transitions from a two-dimensional conductive pattern layout to a three-dimensional stacked lead configuration. By superimposing leads in the vertical dimension, the patent achieves high current capacity without increasing the horizontal footprint of the device, effectively resolving the contradiction between power handling and device size.
Solution Approach 2:
The patent implements a nested structure where one lead is positioned within or adjacent to another lead in the vertical stacking arrangement. This nesting approach allows multiple current-carrying paths to occupy minimal planar space, enabling high current capacity while maintaining compact device dimensions.
2Power
If the width of the conductive pattern is widened to secure large current capacity, then the current handling capacity is improved, but the risk of short circuit between circuit board and conductive pattern increases
Solution Approach 1:
By moving the current-carrying leads to the upper surface and stacking them vertically, the patent eliminates the need for wide conductive patterns on the circuit board. This dimensional transition removes the source of short circuit risks while maintaining high current capacity through the stacked lead configuration.
Solution Approach 2:
The patent extracts the high-current conduction function from the circuit board's conductive patterns and relocates it to dedicated leads positioned on the upper surface. This separation removes the conflicting requirements between the circuit board layout and high-current path needs, eliminating short circuit risks.
3Area of stationary object
If leads are disposed to be superimposed on each other, then the area occupied on the upper surface is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent incorporates the leads with insulating layers pre-attached before mounting the semiconductor element. This preliminary preparation of lead structures with insulation already in place simplifies the overall manufacturing process by reducing the number of subsequent assembly steps required to achieve the stacked, insulated configuration.
Data Source
AI summary
A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. A lead (30) and lead (28) though which high current passes are disposed superimposed on the upper surface of a circuit board (12). Also, a plurality of ceramic substrates (22A-22F) are affixed to the circuit board (12), and transistors, diodes, or resistors are mounted to the upper surface of the ceramic substrates. Furthermore, the circuit elements such as the transistors or diodes are connected to the lead (28) or the other lead (30) via fine metal wires.