Superimposed Leads for Compact High Current Circuit Device
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Solution Overview
Problem
Conventional hybrid integrated circuit devices face challenges in downsizing when equipped with semiconductor elements for high current switching due to the need for wide conductive patterns, which increases the device size and introduces the risk of short circuits.
Innovation Solution
The circuit device employs three leads (first, second, and third leads) connected to the semiconductor element, with the leads being superimposed on each other and insulated from the circuit board, eliminating the need for a conductive pattern on the board surface and allowing for reduced area occupation, thereby enabling downsizing while maintaining high current switching capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the width of the conductive pattern is widened to secure large current capacity, then the current handling capacity is improved, but the device size increases
Solution Approach 1:
The patent transitions from planar conductive patterns on the substrate surface to three-dimensional superimposed leads. Multiple leads are stacked vertically and insulated from each other, allowing high current capacity without increasing the substrate area. This dimensional change from 2D to 3D spatial arrangement resolves the contradiction between current handling capability and device footprint.
2Power
If the width of the conductive pattern is widened to secure large current capacity, then the current handling capacity is improved, but the risk of short circuit between circuit board and conductive pattern increases
Solution Approach 1:
By stacking leads in the vertical dimension and providing insulation between them and the substrate, the patent eliminates the short circuit risk inherent in wide surface conductive patterns. The insulated superimposed leads maintain electrical isolation while carrying high currents, resolving the reliability issue.
Solution Approach 2:
The patent introduces insulation as an intermediary between the superimposed leads and the substrate, preventing direct contact that could cause short circuits. This intermediary layer enables high current handling without compromising electrical isolation and system reliability.
3Area of stationary object
If leads are superimposed on each other to reduce area occupation, then the device size is reduced, but the complexity of lead arrangement increases
Solution Approach 1:
The patent merges multiple leads into a compact superimposed structure where they occupy the same planar footprint but are separated in the vertical dimension. This combining approach reduces area occupation while the insulation and systematic arrangement manage the complexity of having multiple leads in close proximity.
Data Source
AI summary
A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. The hybrid integrated circuit device (10) is provided with: a circuit board (12); a plurality of ceramic substrates (22A-22G) disposed on the top surface of the circuit board (12); circuit elements such as transistors mounted on the top surface of the ceramic substrates (22A-22G); and a lead (29) or the like that is connected to the circuit elements and is exposed to the outside. Furthermore, in the present embodiment, leads (28, 30, 31A-31C) are disposed superimposed in the vicinity of the center of the circuit board (12), and a circuit element such as an IGBT is disposed and electrically connected approaching the region at which the leads are superimposed. The alternating current transformed by the IGBT is output externally via the leads (31A, etc.).