Superlattice Resistance Memory Device for Low Current Operation
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Solution Overview
Problem
Conventional resistance change nonvolatile memory devices lack excellent performance in terms of lowering current.
Innovation Solution
A nonvolatile memory device configuration featuring a first conductive portion, an insulating film, an intermediate layer with a ring-shaped hole, and a superlattice film containing Sb2Te3 and GeTe, where the superlattice film exhibits resistance change states due to phase changes, facilitating low resistance at a triple point formed by crystal grain boundaries, enabling efficient current flow and binary information storage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional resistance change nonvolatile memory devices are used, then basic memory functionality is achieved, but current consumption is high and performance is poor
Solution Approach 1:
The patent changes the physical and chemical parameters of the memory layer by using a superlattice structure with alternating Sb2Te3 and GeTe layers. This superlattice structure undergoes phase transitions between crystalline and amorphous states, dramatically changing electrical resistance. The specific parameters changed include crystal structure, phase state, and electrical conductivity, enabling low-current operation while maintaining reliable memory functionality
Solution Approach 2:
The patent exploits phase transitions of the superlattice film between crystalline and amorphous states to achieve resistance changes. By applying heat or electrical current, the material transitions between phases, creating distinct high-resistance and low-resistance states that represent binary data. This phase transition mechanism enables efficient current control and reliable memory storage with lower current consumption
2Loss of energy
If conventional memory structures are used, then manufacturing is straightforward, but current lowering performance is insufficient
Solution Approach 1:
The patent segments the memory layer into a superlattice structure with multiple alternating layers of Sb2Te3 and GeTe. This segmentation into thin alternating layers creates the necessary phase transition properties while maintaining compatibility with existing manufacturing processes. The segmented structure can be deposited layer-by-layer using standard sputtering or molecular beam epitaxy techniques
Solution Approach 2:
The patent uses a composite superlattice material combining Sb2Te3 and GeTe in alternating layers. This composite structure leverages the complementary properties of both materials to achieve superior phase transition characteristics and resistance change ratios. The composite nature allows tuning of physical properties by adjusting layer thickness ratios while remaining manufacturable with existing thin-film deposition technologies
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves improved performance in lowering current and efficient binary information storage by utilizing the resistance change properties of the superlattice film at the triple point, enhancing the overall performance of resistance change nonvolatile memory devices.
Implementation Method 1
a first film (18) including a first portion provided on the intermediate layer (17) and at least one second portion provided in the intermediate layer (17) outside an upper edge of the first conductive portion (14), the first film including, above the first conductive portion (14), a resistance change portion (18p) that has a first resistance state and a second resistance state
Data Source
AI summary
According to one embodiment, a nonvolatile memory device includes a first conductive portion, an insulating film surrounding a side surface of the first conductive portion, an intermediate layer provided on the first conductive portion and the insulating film, a first film including a first portion provided on the intermediate layer and at least one second portion provided in the intermediate layer and outside an upper edge of the first conductive portion, the first film including, above the first conductive portion, a resistance change portion that has a first resistance state and a second resistance state having resistance higher than resistance in the first resistance state, and a second conductive portion provided at least on the resistance change portion.


