Superpower Gating Cell for Integrated Circuit Power Network
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As semiconductor processes are miniaturized, the increased resistance and capacitance of conductive lines in integrated circuits lead to signal delays and higher power consumption, reducing the performance of integrated circuits.
Innovation Solution
The introduction of a superpower gating cell structure, which includes multiple power gating cells connected via conductive lines in different metal layers to minimize resistance and capacitance, allowing for efficient power supply to intellectual property blocks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor processes are miniaturized, then integration density is improved, but resistance and capacitance of conductive lines increase
Solution Approach 1:
The patent introduces a third vertical dimension by stacking multiple power rails (first power rail, second power rail, third power rail) in different metal layers. This three-dimensional power network architecture reduces the horizontal distance between power delivery points and standard cells, thereby reducing resistance and capacitance effects while maintaining high integration density.
Solution Approach 2:
The power network is segmented into multiple independent power rails at different vertical levels. Each power rail can be independently controlled by power gating cells, allowing localized power management. This segmentation reduces the load on individual conductive lines, thereby reducing IR drop and power consumption.
2Productivity
If semiconductor processes are miniaturized, then integration density is improved, but signal transition is delayed
Solution Approach 1:
By adding vertical stacking of power rails in multiple metal layers, the patent creates shorter current paths and reduces the distance signals need to travel horizontally. This three-dimensional configuration reduces RC delays and improves signal transition speed while maintaining high integration density.
3Use of energy by stationary object
If conventional power gating cells are used, then power supply is provided, but IR drop occurs and performance is reduced
Solution Approach 1:
The stacked power rail configuration in multiple vertical layers reduces the resistance of power delivery paths by providing multiple parallel current paths. This reduces IR drop and improves power supply efficiency and circuit performance.
Solution Approach 2:
Multiple power rails in different metal layers are merged to work together as a unified three-dimensional power network. The power gating cells control multiple rails simultaneously, combining their effects to deliver power more efficiently and reduce IR drop compared to conventional single-rail configurations.
Data Source
AI summary
An integrated circuit includes an intellectual property (IP) block including a plurality of standard cells. A first power gating cell supplies power to the IP block via a first power rail extending in a first horizontal direction. A first conductive line extends in a second horizontal direction perpendicular to the first horizontal direction in a first metal layer. A second power gating cell is arranged adjacent to the first power gating cell in the second horizontal direction to supply power to the IP block via a second power rail extending in the first horizontal direction. A second conductive line extends in the second horizontal direction in the first metal layer. The first conductive line is coupled with the second conductive line in the second horizontal direction.