Supply Terminal Thermal Bridge for Accurate Current Sensing
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Solution Overview
Problem
There is a compromise between heat dissipation and accurate current measurement in electronic components due to the constricted region of the supply terminal, which limits heat energy passage and affects magnetic flux, compromising sensor accuracy.
Innovation Solution
Incorporating a non-magnetic thermal bridge that provides a parallel thermal conduction path around the constricted region of the supply terminal, allowing for efficient heat dissipation while maintaining sufficient magnetic flux for accurate current measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a constricted region is introduced in the supply terminal to enhance current measurement capability, then measurement precision is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The thermal management function is segmented from the electrical connection function. The supply terminal is divided into a full-width region (for heat dissipation and electrical connection) and a constricted region (for current measurement). The thermal bridge is introduced as a separate component to provide additional thermal conduction path, effectively separating the thermal management function from the electrical connection structure.
Solution Approach 2:
The thermal bridge acts as an intermediary component that provides a parallel thermal conduction path between the power semiconductor die and the heat sink. It mediates the thermal flow around the constricted region, allowing heat to bypass the narrow section while the constricted region maintains sufficient magnetic flux for accurate current measurement.
2Measurement precision
If the supply terminal width is reduced in the constricted region to improve current measurement, then measurement precision is improved, but thermal conduction capability deteriorates
Solution Approach 1:
The thermal conduction path is extended into a third dimension by introducing the thermal bridge that bridges across the constricted region. This creates a parallel thermal pathway that does not rely on the width of the supply terminal in the constricted region, effectively adding a dimensional route for heat flow that bypasses the narrow section.
3Loss of energy
If a thermal bridge is added to improve heat dissipation, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The thermal bridge is integrated with the existing enclosure structure, merging the thermal management function with the mechanical housing. The thermal bridge can be formed as part of the enclosure or attached to it, combining structural support and thermal conduction functions into a single integrated component rather than adding a completely separate element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal bridge enhances heat dissipation and reduces the impact of temperature on the sensor, enabling more precise current measurements by minimizing interference from stray magnetic fields and thermal effects.
Implementation Method 1
providing a thermal conduction path that is in parallel with a thermal conduction path of the supply terminal
Implementation Method 2
the thermal bridge is non-magnetic and has a thermal conductivity that is higher than a thermal conductivity of the enclosure
Data Source
AI summary
An electronic device includes an enclosure, one or more power semiconductor dies within the enclosure, a supply terminal, and a thermal bridge. The supply terminal is electrically connected to the one or more power semiconductor dies and is at least partially exposed from the enclosure. The supply terminal extends lengthwise in a longitudinal direction and includes a constricted region where a width of the supply terminal reduces in a lateral direction transverse to the longitudinal direction. The thermal bridge is distinct from the enclosure. The thermal bridge bridges the constricted region and provides a thermal conduction path that is in parallel with a thermal conduction path of the supply terminal. The thermal bridge is non-magnetic and has a thermal conductivity that is higher than a thermal conductivity of the enclosure.