Supply Valve Cv Characteristic Correction in Semiconductor Film Formation

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Solution Overview

Problem

The fluctuation of valve characteristic values, such as the Cv value, due to long-term operation or external factors leads to inconsistent film formation results in semiconductor manufacturing, causing potential product lot-outs and matching issues between film thickness and uniformity across devices.

Innovation Solution

A correction recipe is executed to check and calculate the Cv value of the supply valve by supplying an inert gas into the process gas supply line while the adjusting valve is fully open, allowing for precise measurement and adjustment of the valve characteristics, thereby stabilizing film formation processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a valve with strictly measured Cv value is used, then film formation result is improved, but Cv value fluctuates due to long-term operation or external factors

Engineering Contradiction:
Improvefilm formation resultVSAvoidvalve characteristic stability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies preliminary action by measuring the Cv value of the valve before actual film formation processing. This allows the system to detect valve characteristic changes in advance and adjust or replace the valve before they affect manufacturing precision, thereby resolving the contradiction between initial precision and long-term reliability.

Inventive Principle:
Principle #10Preliminary action

2Productivity

If the valve is used for long-term operation, then productivity is improved, but Cv value fluctuates due to opening/closing operations or temperature changes

Engineering Contradiction:
Improvecontinuous production capabilityVSAvoidvalve characteristic stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent implements feedback by continuously monitoring the Cv value of the valve during operation. The system compares the measured Cv value against reference values and triggers alerts or automatic adjustments when deviations are detected, allowing the valve to maintain reliable performance throughout long-term operation and ensuring consistent film formation results.

Inventive Principle:
Principle #23Feedback

3Adaptability or versatility

If the valve operates in different device environments, then adaptability is improved, but Cv value fluctuates due to environmental differences

Engineering Contradiction:
Improvedevice environment compatibilityVSAvoidfilm thickness uniformity
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent applies parameter changes by measuring and adjusting the Cv value according to specific device environmental conditions. The system establishes reference Cv values for different environments and adjusts the valve operation parameters accordingly, allowing the same valve to maintain consistent film thickness uniformity across various device environments while preserving adaptability.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method prevents product lot-outs by ensuring consistent valve characteristics, maintaining film thickness uniformity, and reducing the impact of external factors on the manufacturing process, thereby enhancing the reliability and quality of semiconductor device production.

Implementation Method 1

detecting a pressure value in a supply pipe provided with the supply valve while supplying the inert gas into the process gas supply line

Methodology Applied
Scientific EffectPressure drop: Pressure Drop

Data Source

PatentUS11535931B2Method of manufacturing semiconductor device, method of managing parts, and recording medium
Publication Date: 2022.12.27 KOKUSAI DENKI KK
  • US11535931B2 patent drawing
  • US11535931B2 patent drawing
  • US11535931B2 patent drawing

AI summary

There is provided a technique that includes executing a process recipe for processing a substrate; and executing a correction recipe for checking a characteristic value of a supply valve installed at a process gas supply line, wherein the act of executing the correction recipe comprises: supplying an inert gas into the process gas supply line for a certain period of time in a state where an adjusting valve that is installed at an exhaust portion of a process furnace and adjusts an internal pressure of the process furnace is fully opened; detecting a pressure value in a supply pipe provided with the supply valve while supplying the inert gas into the process gas supply line in the state where the adjusting valve is fully opened; and calculating the characteristic value of the supply valve based on the detected pressure value.