Substrate Support Ball Capture Lip for Low-Particle Wafer Handling
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Solution Overview
Problem
Contamination and substrate scratching during substrate handling in vacuum processing chambers are exacerbated by dislodged support balls, which cause particle generation and damage to substrates and expensive components, necessitating improved substrate handling devices.
Innovation Solution
A method and tool for securing a support ball in a substrate support by forming a capture lip in an opening to retain the ball, ensuring it does not disengage, using a deformation tool to displace substrate material inward and set the ball's exposure height, thereby preventing direct contact and minimizing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If support balls are used to minimize substrate contact area, then substrate scratching is reduced, but support balls may become dislodged causing contamination and damage
Solution Approach 1:
The support ball assembly is segmented into three components: the support ball itself, the opening in the substrate support, and the capture lip feature. This segmentation allows the support ball to be retained within the opening by the capture lip, preventing dislodgment while maintaining the minimal contact area benefit for substrate handling
Solution Approach 2:
The capture lip acts as an intermediary feature between the support ball and the opening. It provides a mechanical retention structure that secures the support ball in place, preventing it from becoming dislodged during substrate handling operations while allowing the support ball to maintain its function of minimizing substrate contact
2Object-generated harmful factors
If support balls are secured firmly to prevent dislodgment, then contamination is reduced, but the complexity of the substrate support increases
Solution Approach 1:
The capture lip feature is applied locally at the opening in the substrate support, rather than requiring a complete redesign of the entire substrate support structure. This localized modification provides the necessary retention function while minimizing the overall complexity increase of the device
Solution Approach 2:
The capture lip is formed as an integral feature of the substrate support during manufacturing, before the support balls are installed. This preliminary formation of the retention structure ensures that support balls are securely retained from the outset, preventing dislodgment and particle generation without requiring additional complex assembly steps
3Reliability
If support balls are pressed deeply into openings to prevent dislodgment, then retention is improved, but the exposure height above the surface decreases
Solution Approach 1:
The capture lip feature utilizes the radial dimension of the opening to provide retention, rather than relying solely on the axial depth. By forming a lip that protrudes into the opening from the surface, the design creates a retention barrier in a different dimensional orientation, allowing the support ball to be securely retained while maintaining adequate exposure height above the surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method extends the service life of substrate supports, reduces particle generation, and increases processing yield by preventing support ball dislodgment, thus reducing downtime and costs.
Implementation Method 1
forming a capture lip in the opening which protrudes into the opening a distance sufficient to retain the support ball
Data Source
AI summary
A method for securing a support ball in a substrate support, a tool for forming a capture lip in a substrate support, and a substrate support having a substrate support ball captured in an opening of the substrate support are provided. In one example, a method for securing a support ball in a substrate support includes pressing a support ball into an opening formed in a first surface of the substrate support which is configured to support a substrate in a vacuum processing chamber, forming a capture lip in the opening which protrudes into the opening a distance sufficient to retain the support ball in the opening support ball, and setting an exposure height that the support ball projects above the first surface the substrate support.