Support Base-Attached Encapsulant for Semiconductor Substrate Warping
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for encapsulating large-area or large-diameter semiconductor substrates and wafers face issues with warping and peeling due to shrinkage stress of epoxy resins, leading to unreliable encapsulation and reduced productivity in mass production.
Innovation Solution
A support base-attached encapsulant with a surface-treated fibrous film and a thermosetting resin layer is used, which inhibits warping and peeling by suppressing shrinkage stress and providing uniformity and homogeneity, while maintaining excellent heat resistance, electrical insulation, and moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy resin is used for encapsulation of large-area substrates or large-diameter wafers, then encapsulation can be achieved, but warping and peeling occur due to shrinkage stress during curing
Solution Approach 1:
The patent changes the chemical composition parameters of the resin by using a two-component system (resin component A with epoxy groups and component B with carboxyl groups) instead of conventional single-component epoxy resin. This compositional change reduces the shrinkage stress during curing, preventing substrate warping and device peeling while maintaining encapsulation reliability
Solution Approach 2:
The patent creates a composite encapsulant system by combining resin component A and resin component B in specific ratios. This composite material approach allows the encapsulant to have reduced shrinkage stress while maintaining adequate strength and adhesion, resolving the contradiction between encapsulation reliability and substrate shape stability
2Shape
If filler content is increased to about 90% by mass to reduce shrinkage stress, then warping is reduced, but viscosity increases and semiconductor devices are peeled during casting and molding
Solution Approach 1:
The patent optimizes the filler content parameter to 30-70% by mass instead of 90%, and changes the resin chemistry to a two-component system that provides adequate flow and adhesion at these lower filler levels. This resolves the contradiction by achieving sufficient shrinkage stress reduction without excessive viscosity that would cause manufacturing defects
3Shape
If elasticity of the encapsulating resin is lowered to reduce shrinkage stress, then warping is improved, but heat resistance and moisture resistance are reduced
Solution Approach 1:
The patent creates a composite resin system where component A (epoxy resin) provides heat and moisture resistance while component B (resin with carboxyl groups) contributes to reduced shrinkage stress. The synergistic combination maintains both shape stability and environmental resistance, resolving the contradiction between warping reduction and reliability maintenance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The encapsulant effectively prevents warping and peeling of semiconductor devices, ensuring high-quality encapsulation with improved reliability and productivity, even for thin substrates, and allows for efficient mass production of semiconductor apparatus.
Implementation Method 1
a support base having one fibrous film or a plurality of the fibrous films being laminated, the fibrous film being subjected to surface treatment with an organosilicon compound
Implementation Method 2
a resin layer composed of a thermosetting resin formed on one surface of the support base
Implementation Method 3
excellent in reliability such as heat resistance, electrical insulation property, and moisture resistance after encapsulating
Implementation Method 4
excellent in reliability such as heat resistance, electrical insulation property, and moisture resistance after encapsulating
Data Source
AI summary
Support base-attached encapsulant for collectively encapsulating a semiconductor device mounting surface of a substrate or semiconductor device forming surface of a wafer, containing a support base having one fibrous film or a plurality of the fibrous films being laminated, the fibrous film subjected to surface treatment with an organosilicon compound, and a resin layer of thermosetting resin formed on one surface of the support base. The support base-attached encapsulant inhibit the substrate or wafer from warping and semiconductor devices from peeling away from the substrate, and collectively encapsulate the semiconductor device mounting surface of the substrate or the semiconductor device forming surface of the wafer even when a large-diameter wafer or large-area substrate is encapsulated. The support base-attached encapsulant has uniformity and homogeneity without opening or tangle of fiber, and is excellent in reliability such as heat resistance, electrical insulation property, moisture resistance, excellent in versatility, economical efficiency, and mass-productivity.