Substrate Support Cleaning Control to Prevent Chamber Over-Etching

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Solution Overview

Problem

Existing substrate processing apparatuses face over-etching issues due to excessive cleaning of processing containers when multiple supports are used, leading to inefficient film formation processes.

Innovation Solution

A substrate processing apparatus with a transfer chamber containing multiple supports, a processing container, a gas supplier for film deposition and cleaning, and a controller to determine the need for cleaning based on film adherence, thereby preventing over-etching by optimizing cleaning operations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If cleaning processing is performed on the processing container for each support, then the support can be cleaned effectively, but the processing container becomes over-etched

Engineering Contradiction:
Improvecleaning effectivenessVSAvoidover-etching of processing container
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The controller includes a determinator that determines whether film adherence on the support has reached a cleaning start condition, and controls notification of cleaning processing accordingly. This feedback mechanism prevents unnecessary cleaning cycles, thereby avoiding over-etching of the processing container while ensuring cleaning is performed when actually needed.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system automatically monitors film accumulation on supports and autonomously determines when cleaning is necessary, eliminating the need for manual intervention or fixed-schedule cleaning. This self-service approach optimizes cleaning timing to prevent over-etching while maintaining cleaning effectiveness.

Inventive Principle:
Principle #25Self-service

2Reliability

If multiple supports are continuously cleaned, then support cleanliness is maintained, but the processing container is over-etched due to excessive cleaning operations

Engineering Contradiction:
Improvesupport cleanlinessVSAvoidprocessing container lifespan
Core Design Contradiction:
ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The determinator continuously monitors film accumulation on each support and only triggers cleaning notifications when the cleaning start condition is met. This feedback-based approach ensures supports are cleaned when needed while avoiding unnecessary cleaning operations that would damage the processing container through over-etching.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

Instead of continuously cleaning all supports regardless of need, the system applies partial cleaning action only to supports that have accumulated sufficient film. This prevents excessive cleaning operations that would otherwise damage the processing container while maintaining adequate cleanliness of supports.

Inventive Principle:
Principle #16Partial or excessive action

3Manufacturing precision

If cleaning processing is performed frequently, then film accumulation is prevented, but unnecessary etching of the processing container occurs

Engineering Contradiction:
Improvefilm formation qualityVSAvoidprocessing container material
Core Design Contradiction:
Manufacturing precisionVSLoss of substance

Solution Approach 1:

The system uses feedback from the determinator to monitor actual film accumulation levels on supports and only initiates cleaning when the cleaning start condition is reached. This prevents premature or excessive cleaning operations that would cause unnecessary etching of the processing container while still maintaining film formation quality.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system performs preliminary monitoring of film accumulation and determines the optimal cleaning timing in advance, rather than using fixed frequent cleaning schedules. This preliminary assessment ensures cleaning is performed just before film accumulation affects manufacturing precision, avoiding unnecessary etching.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively suppresses over-etching by ensuring timely cleaning of supports and processing containers, enhancing film formation efficiency and reducing unnecessary etching.

Implementation Method 1

a gas supplier that supplies a processing gas for depositing a film

Methodology Applied
Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Implementation Method 2

a gas supplier that supplies a processing gas for depositing a film

Methodology Applied
Scientific EffectChemical Vapour Deposition: Chemical Vapour Deposition

Implementation Method 3

a gas supplier that supplies a cleaning gas for removing the deposited film

Methodology Applied
Scientific EffectChemical Etching:

Data Source

PatentUS20260016815A1Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and recording medium
Publication Date: 2026.01.15 KOKUSAI DENKI KK
  • US20260016815A1 patent drawing
  • US20260016815A1 patent drawing
  • US20260016815A1 patent drawing

AI summary

Included are: a processing container in which a support capable of supporting at least one substrate is loaded, and in which the substrate is processed; a transfer chamber including a plurality of the supports and capable of switching the supports and transferring the supports to the processing container; a gas supplier that supplies a processing gas for depositing a film and a cleaning gas for removing the deposited film into the processing container; and a controller including a determinator that determines whether a film adhering to the support by the processing of the substrate has reached a cleaning start condition, and capable of controlling a notification indicating that cleaning processing of the support can be performed when the support has reached the cleaning start condition from a determination result of the determinator.