Substrate Support Member Grooves for Uniform Film Formation
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Solution Overview
Problem
Existing film formation apparatuses face challenges in effectively removing residual films from substrate support members, leading to issues such as non-uniform film thickness and temperature distribution on wafers due to incomplete cleaning processes.
Innovation Solution
The apparatus incorporates a substrate support member with a through-hole and a groove on its side surface forming a flow path for cleaning gas, enhancing the flowability and effectiveness of the cleaning process to remove residual films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cleaning gas is supplied to remove residual films from the substrate support member, then the film formation gas can be removed, but the cleaning gas flow path is blocked by the substrate support member structure
Solution Approach 1:
The substrate support member is divided into multiple functional sections: a main body portion for supporting the substrate, and a protruding portion extending through the stage. The protruding portion includes multiple grooves that segment the cleaning gas flow path, allowing gas to flow through multiple channels around the support member structure, effectively cleaning residual films while maintaining structural integrity.
Solution Approach 2:
Different portions of the substrate support member have different structural characteristics optimized for their specific functions. The main body portion has a configuration optimized for substrate support, while the protruding portion features grooves specifically designed for cleaning gas flow. This local differentiation allows the structure to simultaneously achieve support functionality and cleaning accessibility.
2Device complexity
If the substrate support member has a simple structure, then the device complexity is reduced, but the cleaning gas cannot effectively reach all surfaces to remove residual films
Solution Approach 1:
The cleaning gas flow is extended into the vertical dimension by having the protruding portion extend through the stage thickness. The grooves are arranged along the length of the protruding portion, creating a three-dimensional cleaning flow path that reaches surfaces not accessible from horizontal gas supply alone, ensuring complete removal of residual films.
Solution Approach 2:
The invention uses cleaning gas flow dynamics to achieve effective cleaning. The grooves in the protruding portion are designed to guide and distribute cleaning gas along the support member surfaces, utilizing gas pressure and flow velocity to remove residual films from complex geometries that would be inaccessible to mechanical cleaning methods.
3Reliability
If the substrate support member blocks the through-hole, then the substrate can be supported during film formation, but the cleaning gas flow path is obstructed
Solution Approach 1:
The protruding portion of the substrate support member is nested through the stage, with grooves integrated into its structure. This nested configuration allows the support member to occupy the through-hole space while simultaneously providing internal channels (grooves) for cleaning gas flow, enabling both support and cleaning functions within the same structural volume.
Solution Approach 2:
The cleaning process is performed preliminarily before film formation by supplying cleaning gas through the grooves in the protruding portion. This preliminary cleaning action removes any potential contaminants or residual films from the support member surfaces before substrate processing, ensuring that no harmful substances remain that could affect subsequent film formation quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures reliable removal of residual films, maintaining uniform film thickness and temperature distribution on wafers, thereby improving the yield and quality of semiconductor products.
Implementation Method 1
a groove formed on a side surface of the substrate support member and constituting a flow path of the cleaning gas
Data Source
AI summary
A film formation apparatus includes an evacuable processing container having a stage therein, a first gas supply portion configured to supply a film formation gas into the processing container to form a film on the substrate, a second gas supply portion configured to supply a cleaning gas that removes a film formed inside the processing container, a through-hole formed in the stage, a substrate support member provided in the through-hole to support the substrate and extending in a vertical direction, a height changing mechanism configured to change a relative height of the stage and the substrate support member to switch between a state in which the substrate is supported by the stage and a state in which the substrate is supported by the substrate support member, and a groove formed on a side surface of the substrate support member and constituting a flow path of the cleaning gas.