Inner Support Mount Tape for Thin Die Pick-and-Place Protection
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Solution Overview
Problem
As semiconductor dies become thinner, they are increasingly prone to damage during the pick-and-place process due to handling, leading to reduced yield, reliability issues, and waste in the manufacturing process.
Innovation Solution
A mount tape with a strong inner support layer sandwiched between adhesive layers is used, allowing the semiconductor wafer to be diced while attached, with the inner support layer remaining adhered to the die for protection during handling and placement, reducing the likelihood of damage and stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor dies are made thinner to meet design requirements, then device size and integration are improved, but susceptibility to damage during handling increases
Solution Approach 1:
The patent applies beforehand cushioning by placing a support layer between the adhesive layer and the semiconductor die before handling operations. This support layer provides mechanical reinforcement to thin dies (50 microns or less) during pick-and-place operations, preventing cracks and stress damage that would otherwise occur due to the die's thinness. The support layer is temporarily positioned and then removed after serving its protective function.
Solution Approach 2:
The support layer acts as an intermediary element between the adhesive layer and the semiconductor die. It mediates the mechanical stress during handling by providing a stronger substrate that the die can be supported on, allowing thin dies to be manipulated without direct handling that would cause damage. The intermediary support layer is later removed to leave the die in its final position.
2Device complexity
If conventional mount tape without inner support layer is used, then manufacturing process is simple, but die damage occurs during pick-and-place
Solution Approach 1:
The mount tape structure is segmented into multiple functional layers: a backing layer, an adhesive layer, and a support layer. This segmentation allows each layer to perform its specific function - the adhesive layer provides bonding, while the support layer provides mechanical reinforcement. The segmented structure resolves the contradiction by adding complexity only where needed (the support layer) while maintaining simplicity in other aspects.
Solution Approach 2:
The mount tape uses composite material construction by combining different materials with complementary properties. The adhesive layer provides bonding capability while the support layer provides mechanical strength. This composite structure allows the mount tape to both hold the die securely and protect it during handling, resolving the contradiction between structural simplicity and die integrity.
3Productivity
If thin semiconductor dies are handled directly without support, then manufacturing process is fast, but yield decreases due to damage
Solution Approach 1:
The support layer is applied in advance to the adhesive layer before the die picking and placement operations begin. This preliminary action ensures that the thin dies are already protected when they are attached to the mount tape, allowing fast manufacturing operations to proceed without damage. The support layer is removed after the protective function is complete, maintaining high productivity while improving die survival rate.
Data Source
AI summary
Implementations described herein relate to a mount tape and methods of using the mount tape for semiconductor device manufacturing. The mount tape may include a first adhesive layer configured for release at a first stage of a semiconductor device manufacturing process, a second adhesive layer configured for release at a second stage of the semiconductor device manufacturing process, and an inner support layer positioned between the first adhesive layer and the second adhesive layer and configured for removal during the semiconductor device manufacturing process.