Support Pin Positioning for Substrate Transport Interference Avoidance
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Solution Overview
Problem
In high-density substrate component mounting, support pins must recede to avoid interference with components on the substrate's back side, leading to increased movement distance and waiting time, which hampers production efficiency due to uncertain component heights.
Innovation Solution
A substrate transport apparatus and method utilizing a support pin lift unit and component height data storage to adjust the support pin's position based on stored component height data, allowing the pin to ascend during mounting and descend during carrying operations to avoid interference, thus optimizing the support pin's travel distance and reducing waiting time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the support pin is caused to recede to a height spaced a sufficient distance apart from the back side of the substrate to avoid interference with components of uncertain height, then the reliability of avoiding interference is improved, but the distance over which the support pin moves becomes longer and the mounting waiting time increases
Solution Approach 1:
The system uses height detection means to measure the actual height of components mounted on the substrate back side, and feeds this information back to the control means. The control means then adjusts the support pin recession height based on this feedback, rather than using a fixed conservative height. This closed-loop feedback mechanism allows the support pin to recede to the minimum necessary height, avoiding unnecessary movement distance and reducing mounting waiting time while maintaining reliable interference avoidance.
Solution Approach 2:
The system dynamically changes the support pin position parameter based on the detected component height. Instead of maintaining a fixed recession height, the support pin position is adjusted according to the actual component dimensions. This parameter adaptation allows optimization of the support pin movement distance while ensuring reliable interference avoidance, directly reducing the mounting waiting time.
2Reliability
If the support pin is caused to recede to a height spaced a sufficient distance apart from the back side of the substrate to avoid interference with components, then the safety margin is improved, but the support pin movement distance increases leading to reduced productivity
Solution Approach 1:
The height detection means continuously monitors component heights and provides feedback to the control system. This real-time feedback enables the support pin to recede to the precise minimum height needed for interference avoidance, rather than using excessive conservative distances. The result is reduced support pin movement distance and shortened mounting waiting time, directly improving productivity while maintaining adequate safety margins through active monitoring and adjustment.
Solution Approach 2:
The system transitions from a static, fixed support pin recession height to a dynamic adjustment mechanism. The support pin position is continuously adapted based on detected component heights, allowing the system to optimize the safety margin dynamically. This dynamic approach reduces unnecessary movement distance and waiting time, thereby improving mounting production efficiency while maintaining reliable interference avoidance.
3Reliability
If the support pin waits at a lower position to avoid interference with components during substrate carrying-in operation, then the interference avoidance is improved, but the support pin must move a longer distance to reach the support position during mounting operation
Solution Approach 1:
The control system uses height detection feedback to determine the optimal support pin waiting position during substrate carrying-in. Instead of waiting at a fixed low position, the support pin waits at a height that is sufficient to avoid interference with the detected component height. This feedback-based positioning reduces the subsequent movement distance required to reach the mounting support position, while maintaining reliable interference avoidance during the carrying-in operation.
Data Source
AI summary
To provide a substrate transport apparatus and a substrate transport method that enable curtailing of a mounting wait time incidental to movement of support pins.Height data pertaining to components 10 mounted on a back side of a substrate 1 are stored beforehand. During substrate carrying-in operation, support pins 7 are caused to descend according to component height data and wait at a height h1 where to be able to avoid interference with the components 10. During substrate carrying-out operation, the support pins 7 are caused to descend according to the component height data and recede to the height h1 where to be able to avoid interference with the components 10.