Substrate Support Plate Geometry for Uniform Charge Discharge
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Solution Overview
Problem
Existing substrate support devices in semiconductor manufacturing face challenges in efficiently discharging residual charges after processing, leading to substrate sticking and breaking issues, which affect productivity.
Innovation Solution
A substrate processing apparatus with a chamber, substrate support platform, lamp, and a plate with specific hole configurations and a reflection portion that enhances light dispersion and irradiation, allowing for improved discharge performance and voltage monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional plate structure is used with uniform holes, then the manufacturing is simple, but the light distribution on the substrate support platform is uneven, resulting in poor discharge performance
Solution Approach 1:
The plate structure employs different hole configurations in different regions: the first region has holes with first diameters while the second region has holes with second diameters that are different from the first diameters. This local variation in hole quality enables differentiated light distribution across the substrate support platform, improving discharge performance in specific areas without requiring complete structural redesign.
Solution Approach 2:
The plate is divided into multiple regions (first region and second region) with distinct hole patterns. This segmentation allows independent optimization of light distribution in different areas, enabling the system to achieve uniform overall discharge performance while maintaining manageable manufacturing complexity through modular design.
2Reliability
If the plate structure is modified to improve light distribution, then the discharge performance improves, but the manufacturing complexity increases
Solution Approach 1:
Instead of redesigning the entire plate structure, the invention applies localized modifications by creating different hole diameters in specific regions. This approach improves surface discharge performance where needed while keeping the overall manufacturing process similar to conventional plates, thus balancing performance improvement with manufacturing ease.
3Productivity
If residual charges are not properly discharged, then the substrate support device maintains electrostatic grip, but substrate sticking and breaking occurs
Solution Approach 1:
The patent implements a discharge operation that irradiates light through the plate structure with differentiated hole diameters before substrate processing. This preliminary discharge action removes residual charges that would otherwise cause substrate sticking and breaking during subsequent processing, ensuring substrate integrity while maintaining manufacturing efficiency.
Solution Approach 2:
The differentiated hole diameters in different plate regions create localized light distribution patterns that effectively discharge residual charges across the substrate support surface. This ensures uniform charge elimination, preventing substrate sticking and breaking while maintaining high productivity through efficient discharge operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively reduces substrate sticking and breaking phenomena by ensuring even discharge and controlled voltage levels, enhancing productivity in semiconductor device manufacturing.
Implementation Method 1
a lamp disposed at an upper portion of the chamber, and emitting light to an inside of the chamber
Implementation Method 2
the plate includes a reflection portion surrounded by the plurality of holes, and the reflection portion of the plate protrudes higher than any other region of the plate
Implementation Method 3
The substrate support device may support and/or fix the substrate to a surface of the substrate support device by using an electrostatic force
Implementation Method 4
for at least a first hole of the plurality of holes, a diameter of the hole becomes greater in a direction going downward from a top surface of the plate toward a bottom surface of the plate
Data Source
AI summary
A substrate processing apparatus including a chamber, a substrate support platform provided inside the chamber, a lamp disposed at an upper portion of the chamber, and emitting light to an inside of the chamber, and a plate interposed between the lamp and the substrate support platform in the chamber, and including a plurality of holes through which the light, when emitted by the lamp, passes, wherein a surface of the substrate support platform is positioned to be irradiated with the light, and wherein for at least a first hole of the plurality of holes, a diameter of the hole becomes greater in a direction going downward from a top surface of the plate toward a bottom surface of the plate.