Support Plate Decompression Sequencing for Warped Substrates
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Solution Overview
Problem
Existing substrate treating apparatuses face challenges in securely seating warped substrates without causing damage during processing, particularly due to uneven decompression that can lead to cracks or breakage.
Innovation Solution
A substrate treating apparatus with a support plate featuring decompression holes and movable pins that adjust decompression order based on substrate warping, using capacitive touch sensing to determine contact points and applying elastic force to manage substrate deformation, combined with a controller to sequence decompression and cooling paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If uniform decompression is applied to the support plate, then the decompression process is simple and fast, but warped substrates may crack or breakage due to uneven force distribution
Solution Approach 1:
The support plate is divided into multiple decompression regions with separate decompression holes and flow paths. Each region can be decompressed independently through controlled flow path closure, allowing differential decompression rates across the plate surface to match substrate warping patterns and prevent cracking.
Solution Approach 2:
The system dynamically adjusts decompression timing and rates based on real-time substrate contact detection. Movable pins detect substrate position and trigger sequential closure of flow path closures in a predetermined order, transforming static uniform decompression into dynamic adaptive decompression that follows substrate deformation patterns.
2Adaptability or versatility
If movable pins are used to detect substrate contact points, then decompression can be adapted to substrate shape, but device complexity increases due to additional sensing and control mechanisms
Solution Approach 1:
Capacitive touch sensing replaces complex mechanical contact sensors. The movable pins function as capacitive sensors that detect substrate proximity through electrical field changes rather than physical contact, simplifying the sensing mechanism while maintaining adaptive decompression capability.
Solution Approach 2:
The system uses the substrate's own deformation pattern to control the decompression sequence. As the substrate warps and contacts different regions of the support plate, it automatically triggers the capacitive sensors and initiates the sequential flow path closure, making the substrate itself the control signal source.
3Reliability
If sequential decompression of multiple flow paths is implemented, then substrate damage is prevented, but the decompression process time increases
Solution Approach 1:
The flow path closures are pre-programmed with a predetermined closure order based on expected substrate warping patterns. This preliminary configuration allows the system to execute sequential decompression without real-time decision delays, reducing process time while maintaining the protective benefits of differential decompression.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents substrate damage by adapting decompression to the warped substrate's shape, improving manufacturing yield and reliability by ensuring controlled substrate support and deformation management.
Implementation Method 1
A position of the movable pin that first comes into contact with the conductive line, among the plurality of movable pins, may be specified by a capacitive touch sensing method.
Implementation Method 2
The plurality of movable pins may further include an elastic member configured to apply elastic force in a direction opposite to the first direction.
Data Source
AI summary
A substrate treating apparatus includes a support plate having a first decompression hole and a second decompression hole in a first surface facing a substrate and including a first decompression flow path connected to the first decompression hole and a second decompression flow path connected to the second decompression hole, a plurality of movable pins protruding from the first surface of the support plate and configured to contact a conductive line according to movement in a first direction, and a controller configured to adjust an order of decompressing the first decompression flow path and the second decompression flow path.