Support Plate Flow-Path Plating for Corrosion-Resistant Cooling
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Solution Overview
Problem
In semiconductor manufacturing, the cooling plate used in the cooling process often experiences corrosion and leakage defects due to the presence of foreign materials or corrosive substances in the inner flow path, which complicates the surface treatment of the inner flow path.
Innovation Solution
A support plate is designed with separate penetration holes at the inflection points of the inner flow path, allowing for the flow of ions during electroless plating or electrolytic plating, thereby enabling surface treatment on the inner flow path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the inner flow path groove is closed by cover plates to form a sealed cooling channel, then cooling efficiency is improved, but surface treatment on the inner flow path becomes impossible due to inaccessibility
Solution Approach 1:
The inner flow path is segmented into treatment-accessible regions and sealed cooling regions. Penetration holes are created at specific locations (inflection points) to allow surface treatment access while maintaining the sealed structure for cooling efficiency in other areas.
Solution Approach 2:
Surface treatment is performed on the inner flow path before the cover plates are fully installed and sealed. The penetration holes are prepared in advance to enable plating operations, and after treatment, the holes are sealed to maintain cooling efficiency.
2Temperature
If the inner flow path is made of aluminum for good thermal conductivity, then cooling performance is improved, but corrosion resistance deteriorates due to susceptibility to corrosive substances
Solution Approach 1:
A composite structure is created by applying a plating layer (such as nickel or other corrosion-resistant materials) on the aluminum inner flow path. This combines the high thermal conductivity of aluminum with the corrosion resistance of the plating material, resolving the contradiction between cooling performance and durability.
3Ease of manufacture
If penetration holes are created for surface treatment access, then surface treatment capability is improved, but structural integrity deteriorates due to additional holes in the flow path
Solution Approach 1:
Penetration holes are created only at specific locations (inflection points) where surface treatment is most needed, rather than throughout the entire flow path. This localized approach minimizes the impact on structural integrity while still enabling necessary surface treatment operations.
Solution Approach 2:
The penetration holes are temporarily created to enable surface treatment, and after treatment is complete, the holes are sealed with sealants or plugs. This preliminary access approach allows surface treatment without permanent structural compromise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The support plate facilitates effective surface treatment of the inner flow path by allowing ion flow during plating processes, thereby preventing corrosion and leakage defects, and ensuring reliable cooling and surface treatment in semiconductor manufacturing.
Implementation Method 1
the stopper member may be welded to the penetration hole by a laser
Implementation Method 2
the stopper member may be fused to the penetration hole by an ultrasonic welding method
Implementation Method 3
the flow of ions during electroless plating or electrolytic plating to allow surface treatment on an inner flow path
Implementation Method 4
the flow of ions during electroless plating or electrolytic plating to allow surface treatment on an inner flow path
Data Source
AI summary
It is disclosed that a support plate configured to enable the flow of ions during electroless plating or electrolytic plating to allow surface treatment on an inner flow path, a method of manufacturing the support plate and a substrate processing device having the support plate. A support plate includes an upper plate, a lower plate, and a stopper member. The lower plate has a formed inner flow path, disposed to face the upper plate, and has a plurality of penetration holes formed corresponding to each of the inflection points of the inner flow path. The stopper member is inserted into the penetration hole in a state in which the upper plate and the lower plate are bonded to each other. Therefore, by forming a separate penetration hole in a structure in which coating or plating of the inner flow path is not possible, the flow of ions during electroless plating or electrolytic plating is possible and surface treatment is possible.