Support Plate Design for Heat Dissipation Flatness

Solution Overview

Problem

The existing heat dissipation structures in electronic devices face challenges with uniform flatness, leading to insufficient coupling with circuit boards, resulting in inadequate heat dissipation and potential warping, which can cause 'hot spots' and weaken shielding functions.

Innovation Solution

Incorporating a support plate that contacts heat pipes and extends to the heat dissipation plate, ensuring close proximity and improved bonding with the circuit board, thereby enhancing heat diffusion and reducing the likelihood of lifting and warping.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the size of the heat dissipation plate is increased, then heat dissipation performance is improved, but uniform flatness becomes difficult to maintain

Engineering Contradiction:

Improveheat dissipation performanceVSAvoiduniform flatness

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The heat dissipation structure is divided into multiple segments: a heat dissipation plate, a support plate with reinforcing ribs, and heat pipes. The support plate is segmented into a first portion contacting heat pipes and a second portion coupled to the heat dissipation plate, allowing each segment to be optimized independently for their respective functions while maintaining overall structural integrity and flatness.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat dissipation structure uses composite construction combining different materials and structures: the heat dissipation plate is coupled with heat pipes (phase change heat transfer), and the support plate provides structural reinforcement. This composite approach allows the system to achieve both large surface area for heat dissipation and sufficient structural rigidity to maintain flatness.

Inventive Principle:

Principle #40Composite materials

2Temperature

If the heat dissipation plate is made larger, then heat dissipation capacity is improved, but coupling with the circuit board becomes insufficient

Engineering Contradiction:

Improveheat dissipation capacityVSAvoidcoupling strength

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The support structure is segmented into a support plate with a first portion that contacts heat pipes and a second portion that couples to the heat dissipation plate. This segmentation allows the second portion to provide dedicated structural support and bonding surface for reliable coupling with the circuit board, while the first portion manages heat transfer from the heat pipes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support plate extends in multiple dimensions with reinforcing ribs that increase structural rigidity without significantly increasing the footprint area. The reinforcing ribs add dimensional complexity to the support plate, creating a three-dimensional structure that enhances coupling strength and maintains flatness across the larger heat dissipation plate.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Temperature

If the heat dissipation structure is assembled on the circuit board, then heat dissipation function is achieved, but lifting phenomenon occurs due to non-uniform flatness

Engineering Contradiction:

Improveheat dissipation functionVSAvoidstructural stability

Core Design Contradiction:

TemperatureVSStability of the object's composition

Solution Approach 1:

The support plate with reinforcing ribs is installed beforehand to provide structural support and maintain flatness before the heat dissipation plate is coupled to it. This preliminary structural preparation ensures that when the heat dissipation plate is assembled, the entire structure maintains uniform flatness across the circuit board surface, preventing lifting phenomenon.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The heat dissipation structure uses composite construction combining different materials and structures: the heat dissipation plate is coupled with heat pipes (phase change heat transfer), and the support plate provides structural reinforcement. This composite approach allows the system to achieve both large surface area for heat dissipation and sufficient structural rigidity to maintain flatness.

Inventive Principle:

Principle #40Composite materials

4Ease of manufacture

If flatness is not uniform, then assembly is easier, but heat concentration occurs causing hot spots

Engineering Contradiction:

Improveassembly easeVSAvoidheat concentration

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The heat dissipation structure is divided into multiple segments: a heat dissipation plate, a support plate with reinforcing ribs, and heat pipes. The support plate is segmented into a first portion contacting heat pipes and a second portion coupled to the heat dissipation plate, allowing each segment to be optimized independently for their respective functions while maintaining overall structural integrity and flatness.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support plate acts as an intermediary between the heat pipes and the heat dissipation plate, providing a stable platform that ensures uniform contact and heat distribution. The reinforcing ribs on the support plate maintain flatness and prevent localized heat concentration by distributing thermal energy evenly across the heat dissipation plate surface.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances heat dissipation efficiency and maintains effective shielding by ensuring the heat dissipation module and circuit board are securely coupled, reducing temperature hotspots and maintaining structural integrity.

Implementation Method 1

at least one heat pipe disposed between the heat dissipation plate and the printed circuit board

Methodology Applied

Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

heat dissipation plate... at least one heat pipe disposed between the heat dissipation plate and the printed circuit board

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 3

a support plate disposed between the printed circuit board and the heat dissipation plate... the support plate includes: a first portion disposed so as to contact with at least a part of the at least one heat pipe; and a second portion extending from the first portion

Methodology Applied

Scientific EffectStructural reinforcement:

Data Source

PatentUS12160983B2Electronic device including support plate

Publication Date: 2024.12.03 SAMSUNG ELECTRONICS CO LTD

AI summary

An electronic device and a support plate are disclosed. The electronic device includes a first housing, a display disposed within the first housing, a printed circuit board disposed within the first housing, a heat dissipation plate disposed to face the printed circuit board, at least one heat pipe disposed between the heat dissipation plate and the printed circuit board, the support plate disposed between the printed circuit board and the heat dissipation plate. The support plate includes a first portion disposed so as to contact with at least a part of the at least one heat pipe, and a second portion extending from the first portion in a second direction perpendicular to a first direction in which the at least one heat pipe is disposed, the second portion coupled to at least a part of the heat dissipation plate.