Support Plate Peeling Start Point for Damage-Free Substrate Release
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In fan-out panel level packaging (FOPLP), it is difficult to peel off package devices from a support plate without damaging the wiring layer or the support plate due to the strong adhesive force of the peel layer.
Innovation Solution
A peeling method involving a first holding step, a start point region forming step by blowing a fluid to the end portion of the peel layer, and a peeling step where the holding units are moved apart to separate the substrate from the support plate, optionally including a removing step to clear metallic or resin films from the support plate's surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the adhesive force of the peel layer is increased to ensure strong bonding, then the bonding strength is improved, but the ease of peeling deteriorates and damage to the wiring layer or support plate occurs
Solution Approach 1:
The invention divides the peeling process into two distinct phases: first peeling the substrate from the support plate while it is in a relaxed state (reducing stress on the peel layer), and then peeling the support plate itself. This segmentation allows the strong adhesive force to be maintained during bonding while enabling damage-free separation during peeling by controlling the sequence and timing of separation actions.
Solution Approach 2:
The invention performs a preliminary peeling action by separating the substrate from the support plate before attempting to peel the support plate itself. This preliminary action reduces the stress and adhesive force requirements for the subsequent support plate peeling, preventing damage to the wiring layer and support plate while maintaining strong bonding during the bonding phase.
2Strength
If the adhesive force of the peel layer is increased to ensure strong bonding, then the bonding strength is improved, but the risk of damaging the support plate during peeling increases
Solution Approach 1:
The peeling process is segmented into two stages: first peeling the substrate (which reduces the bonded area and adhesive force), then peeling the support plate. This segmentation prevents excessive stress concentration that would damage the support plate, while the strong adhesive force is maintained during the bonding phase to ensure reliable attachment.
Solution Approach 2:
The substrate is peeled from the support plate as a preliminary action before peeling the support plate itself. This preliminary peeling reduces the total adhesive force that must be overcome and prevents damage to the support plate structure, while the strong bonding is maintained during the initial bonding phase.
3Strength
If the adhesive force of the peel layer is increased to ensure strong bonding, then the bonding strength is improved, but the risk of damaging the wiring layer during peeling increases
Solution Approach 1:
The invention segments the peeling process to first separate the substrate (containing the wiring layer) from the support plate while the system is in a controlled state, minimizing stress on the wiring layer. Then the support plate is peeled separately. This segmentation prevents wiring layer damage while maintaining strong bonding during the bonding phase.
Solution Approach 2:
The substrate peeling is performed as a preliminary action before support plate peeling. This preliminary action removes the substrate and its wiring layer from the stress zone before the support plate peeling occurs, protecting the wiring layer from damage while maintaining strong bonding during the bonding phase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy and damage-free peeling of substrates or small pieces from the support plate, reducing the risk of damaging the wiring layer or the support plate during the peeling process.
Implementation Method 1
a start point region forming step of blowing a fluid to an end portion of the peel layer exposed at an end portion of the support plate and the substrate
Data Source
AI summary
A peeling method for peeling off a substrate provided over a front surface of a support plate through a peel layer from the support plate after dividing the substrate into a plurality of small pieces, the peeling method comprising: a first holding step of holding the support plate by a first holding unit; a dividing step of causing a cutting blade to cut into the substrate, or applying a laser beam of such a wavelength as to be absorbed in the substrate to the substrate, along division lines set on the substrate, to divide the substrate into the plurality of small pieces; a start point region forming step of blowing a fluid to the peel layer exposed at an end portion of a small piece among the plurality of small pieces, to form a start point region which will serve as a start point when peeling off the small piece from the support plate; a second holding step of holding the small piece by a second holding unit; and a peeling step of relatively moving the first holding unit and the second holding unit in directions for spacing away from each other, to peel off the small piece from the support plate.