Semiconductor Support Recess Structure for Warpage-Controlled Singulation

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Solution Overview

Problem

The warpage of supports during the manufacturing of semiconductor devices, caused by differences in thermal expansion coefficients between the support and the mold resin, affects processing precision and efficiency.

Innovation Solution

A method involving the formation of recess portions on the support, filling with a resin layer, and irradiating protrusion portions with a laser beam to create modified portions, which helps in correcting and preventing warpage by generating expansion stress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the support is covered with mold resin, then the semiconductor device structure is completed, but warpage occurs due to thermal expansion coefficient difference

Engineering Contradiction:

Improvestructural completionVSAvoidsupport flatness

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by forming recess portions and filling them with resin before the final molding process. This preparatory step creates a compensation structure that anticipates and counteracts the warpage that will occur during subsequent heating and molding processes, thereby maintaining support flatness while completing the device structure.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent utilizes thermal expansion principles by creating recess portions filled with resin that have different thermal expansion characteristics from the support. When heated during molding, these resin-filled recesses expand differently, generating compensatory stresses that counteract the warpage induced by the overall thermal expansion coefficient difference between the support and mold resin.

Inventive Principle:

Principle #37Thermal expansion

2Productivity

If the support is divided into pieces, then productivity is improved, but processing precision deteriorates due to warpage

Engineering Contradiction:

Improvedivision efficiencyVSAvoiddivision accuracy

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-forming recess portions and filling them with resin before the division process. This preparation creates a compensated support structure that maintains flatness through the molding process, ensuring that when division occurs, the support remains stable and divisible with high precision, thereby achieving both high productivity and high division accuracy.

Inventive Principle:

Principle #10Preliminary action

3Ease of manufacture

If laser beam irradiation is applied to protrusion portions, then modified portions are formed for division, but additional processing steps are added

Engineering Contradiction:

Improvedivision capabilityVSAvoidprocess steps

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent merges multiple functions into the recess portion structure. The same recess portions that are formed to compensate for warpage are also used as the basis for creating modified portions through laser irradiation that enable precise division. This merging of compensation and division functions into a single structural feature reduces overall process complexity while maintaining both warpage prevention and division capability.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively reduces and prevents warpage of the support, improving processing precision and efficiency during the division of the support into pieces, and enhances adhesion during shield sputtering.

Implementation Method 1

A protrusion portion of the support is irradiated with a laser beam to form a modified portion in the protrusion portion

Methodology Applied

Scientific EffectLaser heating: Laser

Implementation Method 2

the support may be warped due to a difference in thermal expansion coefficient between the support and the mold resin

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS12230623B2Method for manufacturing semiconductor device and semiconductor device

Publication Date: 2025.02.18 KIOXIA CORP

AI summary

According to one embodiment, a method for manufacturing a semiconductor device includes forming a plurality of recess portions on a first surface of a support. Each recess portion is between protrusion portions on the first surface. A stacked body is then placed into each of the recess portions. The stacked body is a plurality of semiconductor chips stacked on each other or the like. The recess portions are filled with a resin layer. The resin layer covers the stacked bodies inside the recess portions. A protrusion portion of the support is irradiated with a laser beam to form a modified portion in the protrusion portion. The support is divided along the protrusion portions into separate pieces.