Support Ring Packaging Structure for IC Warpage Control
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Solution Overview
Problem
The increasing density of input/output (I/O) pads on integrated circuit dies due to their miniaturization poses challenges in packaging, particularly in maintaining uniform pressure and thermal dissipation, leading to warpage issues during carrier substrate removal.
Innovation Solution
A support ring is attached around the periphery of the package structure before carrier substrate removal, providing mechanical support and reducing warpage, which enhances the uniformity of pressure exerted on the thermal module, thereby improving thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If integrated circuit dies are miniaturized to increase I/O pad density, then the number of I/O pads per unit area increases, but warpage occurs during carrier substrate removal due to non-uniform pressure and thermal dissipation
Solution Approach 1:
A support ring is introduced as an intermediary component between the package structure and the carrier substrate. This support ring provides mechanical reinforcement to the package structure, distributing forces more uniformly during carrier substrate removal and preventing warpage while allowing high I/O pad density on the miniaturized die
Solution Approach 2:
The support ring is attached to the package structure before carrier substrate removal. This preliminary action strengthens the package structure in advance, ensuring it can withstand the mechanical stresses and thermal gradients during the subsequent carrier substrate removal process without deforming
2Ease of manufacture
If carrier substrate removal is performed without support structures, then manufacturing simplicity is maintained, but non-uniform pressure distribution causes warpage
Solution Approach 1:
The support ring serves as a simple intermediary component that attaches to the package structure before carrier substrate removal. It provides mechanical reinforcement to distribute forces uniformly, maintaining flatness control during the manufacturing process while adding minimal complexity to the overall manufacturing procedure
3Stability of the object's composition
If support structures are added to prevent warpage, then structural stability improves, but device complexity increases
Solution Approach 1:
The support ring is a relatively simple intermediary component that provides significant structural stability during carrier substrate removal. While it does add some complexity to the package structure, the design is straightforward and can be integrated into existing manufacturing processes with minimal additional steps
Solution Approach 2:
The support ring is attached in advance to the package structure before critical manufacturing steps. This preliminary reinforcement ensures structural stability during carrier substrate removal and thermal processing, preventing warpage without requiring complex real-time adjustments or additional manufacturing steps
Data Source
AI summary
In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.