Support Structure Layout for Compact Device Heat Dissipation
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Solution Overview
Problem
As electronic devices integrate multiple functions and are miniaturized for convenience, they face challenges in managing heat dissipation and structural support while maintaining compactness and functionality.
Innovation Solution
The electronic device incorporates a support structure with a partition wall and a heat dissipation member extending between regions, featuring a protection member to block an opening and facilitate heat transfer from one region to another, enhancing thermal management and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the electronic device is miniaturized to improve portability, then the device size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The support structure is divided into multiple regions (first region, second region, third region) separated by partition walls with openings. This segmentation allows heat to be distributed and dissipated across multiple zones rather than concentrated in a single area, effectively managing thermal load in the compact device.
Solution Approach 2:
The heat dissipation member extends vertically through the partition wall opening from the first region to the second region, utilizing the thickness direction (Z-axis) of the device. This three-dimensional heat transfer path enables efficient heat dissipation without increasing the device's planar footprint, resolving the contradiction between miniaturization and thermal management.
2Adaptability or versatility
If multiple functions are integrated into a single device to improve functionality, then the device capabilities are enhanced, but the structural complexity increases
Solution Approach 1:
The support structure serves multiple functions simultaneously: it provides mechanical support for the display device, acts as a heat dissipation pathway through its partition walls and openings, and positions various components (battery, heat dissipation member) within defined regions. This multi-functionality reduces the need for separate structural elements, managing complexity while supporting integrated functionality.
3Volume of moving object
If the device is made compact to improve portability, then the device size is reduced, but structural support becomes more challenging
Solution Approach 1:
The support structure is segmented into multiple regions by partition walls, creating a framework that provides structural reinforcement throughout the device. This segmented framework distributes mechanical loads more effectively than a monolithic structure, maintaining strength while enabling compact dimensions.
Solution Approach 2:
The heat dissipation member is nested within the support structure, extending through openings in the partition walls. This nested arrangement allows the heat dissipation component to be integrated into the existing structural framework without requiring additional space, maintaining both structural integrity and compact size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat and provides structural support, ensuring the device operates efficiently and reliably in a compact form factor.
Implementation Method 1
a heat dissipation member extending from a portion of the first region, through the opening, to a portion of the second region
Data Source
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AI summary
An embodiment disclosed herein may provide an electronic device. The electronic device may include a housing forming a portion of an exterior of the electronic device and including a support structure and a rear plate, wherein the support structure includes a first region, a second region and a partition wall disposed between the first region and the second region, and the partition wall includes an opening, a battery disposed between the second region of the support structure and the rear plate, a protection member disposed to block at least a portion of the opening, and a heat dissipation member extending from a portion of the first region, through the opening, to a portion of the second region. A portion of the heat dissipation member may be disposed between the second region and the battery.