Support Substrate for 3D Memory Array Warping
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Solution Overview
Problem
The increase in the number of stacked layers in three-dimensional memory cell arrays leads to substrate warping due to stress, causing transport errors, substrate breakage, and yield reduction in the manufacturing process.
Innovation Solution
A manufacturing method where a substrate with a higher elastic modulus is used as a support to reinforce a substrate with a lower elastic modulus, utilizing a separable layer to join and detach them without damaging the substrates, maintaining a flat state and preventing warping during the formation of a three-dimensional memory cell array.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of stacked layers in a memory cell array is increased to increase data storage capacity, then the storage capacity is improved, but the substrate is likely to warp due to stress caused by the stacked layers
Solution Approach 1:
A support substrate is introduced as an intermediary between the memory cell array substrate and the processing environment. This support substrate has higher rigidity than the memory cell array substrate and provides mechanical support during manufacturing processes, preventing warping caused by stress from stacked layers while allowing the memory cell array to maintain its high storage capacity
2Quantity of substance
If the number of stacked layers is increased, then the data storage capacity is improved, but transport errors and substrate breakage occur due to warping
Solution Approach 1:
The support substrate is attached beforehand to the memory cell array substrate before manufacturing processes begin. This provides preemptive mechanical support that cushions against stress-induced warping during subsequent processing steps, preventing transport errors and substrate breakage before they can occur
3Shape
If a support substrate with higher elastic modulus is used to prevent warping, then substrate flatness is improved, but the complexity of the manufacturing process increases due to joining and detaching operations
Solution Approach 1:
The support substrate is designed to be temporarily attached during manufacturing processes and then detached when no longer needed. This allows the support substrate to be recovered and reused for subsequent memory cell arrays, reducing overall manufacturing complexity despite the additional joining and detaching operations required for each individual substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively suppresses substrate warping and related errors, allowing for the successful formation of a three-dimensional memory cell array while enabling the reuse of the support substrate, reducing manufacturing costs and improving yield.
Implementation Method 1
A first substrate having a first elastic modulus is joined onto a second substrate having a second elastic modulus higher than the first elastic modulus
Data Source
AI summary
In a manufacturing method of a semiconductor device according to an embodiment, a first substrate having a first elastic modulus is joined onto a second substrate having a second elastic modulus higher than the first elastic modulus. A first semiconductor element is formed on the first substrate. The first substrate is detached from the second substrate.