Support Table with Integrated Light-Emitting Components
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Solution Overview
Problem
Existing support tables for processing semiconductor wafers do not effectively handle the adhesion and separation of wafers during dicing processes, leading to potential damage and residue issues with conventional tapes.
Innovation Solution
A support table with integrated light-emitting components that emit light onto a tape with a light-sensitive adhesive layer, reducing adhesion force and allowing for secure handling and separation of wafers without hairline cracks or residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional tapes are used to adhere wafers to the support table, then the wafer can be held in place during processing, but the tape causes hairline cracks and residue issues during separation
Solution Approach 1:
The patent changes the physical-chemical parameters of the adhesive layer by exposing it to UV light, which modifies its properties from a strong adhesive state to a reduced adhesion state, enabling clean wafer release without cracks or residue
Solution Approach 2:
The patent replaces the mechanical separation process (which causes hairline cracks) with a photochemical process that modifies the adhesive properties through UV light exposure, allowing the wafer to be released without mechanical stress
2Stability of the object's composition
If the tape adhesive layer has strong adhesion to hold the wafer securely, then the wafer remains stable during processing, but it becomes difficult to separate without damage
Solution Approach 1:
The patent makes the adhesive properties dynamic by introducing a light-sensitive component that allows the adhesive strength to be changed on demand - strong during processing (when not exposed to UV) and weak during separation (when exposed to UV), thus resolving the contradiction between stability and ease of separation
Solution Approach 2:
The patent applies UV light exposure as a preliminary action before separation to pre-weakens the adhesive layer, ensuring that the wafer can be easily removed without damage while maintaining strong adhesion during the processing step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures proper adhesion and separation of wafers during processing, preventing damage and residue issues, and enables efficient dicing operations by modifying the adhesive properties of the tape with UV light exposure.
Implementation Method 1
one or more light-emitting components disposed between the baseplate and the support region, wherein the one or more light-emitting components are configured to emit light onto a tape with a light-sensitive adhesive layer
Data Source
AI summary
According to various embodiments, a support table may include: a baseplate including a support structure, the support structure defining a support region over the baseplate to support at least one of a workpiece or a workpiece carrier therein; and one or more light-emitting components disposed between the baseplate and the support region. The one or more light-emitting components are configured to emit light into the support region.