Support Tool Edge Contact Prevention in Heat Treatment
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Solution Overview
Problem
The existing heat treatment apparatus for semiconductor wafers or glass substrates faces issues with particle deposition due to rubbing action between the support member and the support strip, caused by differences in thermal expansion coefficients, leading to potential damage during sudden temperature changes.
Innovation Solution
The apparatus features a support tool with a support part and a support strip where the back of the support part has a convex or concave portion, configured to avoid contact with the edge of the support strip, ensuring contact only at the inner side, thereby preventing particle drop-off on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the support member and support strip are made of different materials (silicon and silicon carbide) to suppress slip, then the reliability of substrate support is improved, but particles are generated due to rubbing action from thermal expansion differences
Solution Approach 1:
The support part is divided into multiple contact points with the support strip, distributing the contact areas to reduce rubbing intensity at each point while maintaining overall support stability
Solution Approach 2:
The harmful rubbing action is eliminated by extracting the support part from contact with the support strip edge, instead contacting only the top surface at inner positions, preventing particle generation while maintaining support function
2Device complexity
If the support part contacts the edge of the support strip, then the support structure is simple, but particles are generated and deposited on the substrate
Solution Approach 1:
The support part is repositioned to contact only the top surface of the support strip at inner positions, extracting it from edge contact that generates particles, thereby eliminating particle deposition while maintaining structural simplicity
Solution Approach 2:
The top surface of the support strip serves as an intermediary contact surface, allowing the support part to be supported without direct edge contact that would generate particles
3Stress or pressure
If the support part has large contact area with the support strip, then the tensile stress is reduced, but the rubbing action increases and generates particles
Solution Approach 1:
The contact area is segmented into multiple small contact points on the top surface of the support strip, distributing the support load while minimizing rubbing action at each point
Solution Approach 2:
The support part has different contact characteristics at different locations: contacting the top surface at inner positions for support while avoiding edge contact, creating local quality differences in the contact interface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents particle deposition on the substrate, enhancing the reliability and integrity of the heat treatment process by minimizing the impact of thermal stress and particle scattering.
Implementation Method 1
a rubbing action occurs between the support member and the support strip due to difference in thermal expansion coefficient between the support member including a plate using silicon as a base material, and the support strips including silicon carbide (SiC)
Data Source
AI summary
Heat treatment apparatus and a method of manufacturing a substrate are provided, in which drop of particles produced by a rubbing action between a support strip and a support member can be prevented. Heat treatment apparatus 10 has a reactor 40 for treating a substrate, and a support tool 30 for supporting the substrate 54 in the reactor 40. The support tool 30 has a support part 57 to be contacted to the substrate 54, and a support strip 67 for supporting the support part 57. A back of the support part 57 has a convex portion or a concave portion, and the back of the support part 54 is configured to be not contacted to an edge of the support strip 67, and contacted to a top of the support strip 67 at inner than the edge of the support strip 67.