Support Unit Thermal Durability via Metallic Brazing
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Solution Overview
Problem
Current electrostatic chucks used in semiconductor manufacturing suffer from reduced lifespan and limited temperature rise due to non-uniform temperature occurrences caused by thermal durability deterioration, resulting from the use of organic bonders like silicon and acrylic, which either lack heat resistance or are damaged by heat.
Innovation Solution
A support unit is designed with a non-conductive support plate and a conductive base plate coupled through a metallic layer and filler, using a conductive composite material with added materials like SiC, Al2O3, or glass fiber to minimize thermal expansion rate differences, and a metallic mesh for enhanced thermal buffering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an organic bonder like silicon or acrylic is used to adhere the support plate and body, then the components can be easily bonded, but the thermal durability deteriorates and lifespan is reduced due to heat damage
Solution Approach 1:
The patent removes the organic bonder layer from the bonding interface between the support plate and base plate. Instead of using adhesive bonding, the invention employs direct mechanical bonding through bonding protrusions and grooves, eliminating the thermal weakness introduced by organic materials while maintaining bonding functionality.
Solution Approach 2:
The patent introduces a metallic layer as an intermediary between the support plate and base plate. This metallic layer serves as a thermal bridge that conducts heat away from the support plate while providing a stable bonding interface, replacing the failed organic bonder with a thermally conductive mediator.
2Use of energy by stationary object
If a conductive material is used for the base plate to conduct heat, then heat transfer is improved, but thermal expansion rate difference causes stress and cracking
Solution Approach 1:
The patent modifies the physical parameters of the bonding interface by creating bonding protrusions and grooves that interlock the support plate and base plate. This mechanical interlocking compensates for thermal expansion differences by allowing controlled movement and stress distribution, preventing cracking while maintaining thermal conduction.
3Stability of the object's composition
If the support plate is made non-conductive to prevent electrical interference, then electrical stability is improved, but thermal management becomes difficult
Solution Approach 1:
The patent segments the thermal management function from the electrical insulation function by creating a separate metallic layer dedicated to heat conduction. The non-conductive support plate maintains electrical stability while the metallic layer handles thermal management, allowing both functions to operate independently without compromise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved thermal durability and prevents cracking and bending issues, allowing for more stable and efficient substrate treatment processes by maintaining uniform temperature and reducing heat stress.
Implementation Method 1
the metallic layer may be deposited to the bottom of the support plate through vacuum deposition or plating
Implementation Method 2
coupling the metallic layer and the base plate through brazing
Implementation Method 3
a conductive composite material obtained by mixing the conductive material and an added material to minimize a heat stress due to a thermal expansion rate difference between the base plate and the support plate
Implementation Method 4
a support plate including an electrode that adsorbs a substrate by electrostatic force
Implementation Method 5
an electromagnetic field is formed in an inner space of a chamber and excites a process gas provided to the chamber to a plasma state
Implementation Method 6
an electromagnetic field is formed in an inner space of a chamber
Data Source
AI summary
Provided is a method of manufacturing a support unit that supports a substrate. The method includes: providing a support plate formed of a non-conductive material and supporting a substrate; providing a base plate disposed below the support plate and formed of a material including a conductive material; and depositing a metallic layer at a bottom of the support plate and coupling the metallic layer and the base plate through brazing.