Substrate Support Unit With Ground Ring for Plasma Uniformity
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Solution Overview
Problem
Existing substrate treatment processes using plasma face challenges in achieving uniform plasma transmission to the substrate, leading to non-uniform treatment outcomes.
Innovation Solution
A support unit with a power supply rod, electrode plate, and a ground ring surrounded by an insulating member, along with a movable ground ring and elevating mechanism, controls plasma flow to enhance uniformity and efficiency of substrate treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If plasma is generated in a chamber for substrate treatment, then substrate treatment process can be performed, but plasma uniformity transmitted to substrate deteriorates
Solution Approach 1:
The ground ring is positioned specifically at the peripheral region of the substrate to address local plasma non-uniformity. By grounding this peripheral region, the patent creates a localized electric field configuration that redirects plasma flow from the center toward the edges, thereby improving plasma distribution uniformity across the substrate surface without compromising overall treatment efficiency
2Manufacturing precision
If a ground ring is added to control plasma flow, then plasma uniformity improves, but device complexity increases
Solution Approach 1:
The ground ring serves multiple functions simultaneously: it acts as an electrical ground to control plasma flow distribution, provides structural support for the substrate periphery, and helps define the electric field configuration. This multi-functionality allows the patent to improve plasma uniformity without proportionally increasing device complexity, as one component accomplishes several objectives
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively controls plasma uniformity and enhances treatment efficiency by adjusting plasma distribution across the substrate, improving treatment uniformity and edge-to-center plasma flow.
Implementation Method 1
Plasma is generated by a very high temperature, a strong electric field, or RF electromagnetic fields, and means an ionized gas condition consisting of ions, electrons, radicals and the like
Implementation Method 2
Plasma is generated by a very high temperature, a strong electric field, or RF electromagnetic fields
Implementation Method 3
a ground ring provided to surround the electrode plate when viewed from the top and including a ground ring to be grounded
Data Source
AI summary
Provided is a support unit included in an apparatus for treating a substrate using plasma and configured to support the substrate. The support unit may include a power supply rod connected to a high-frequency power supply; an electrode plate configured to receive power from the power supply rod; and a ground ring provided to surround the electrode plate when viewed from the top and including a ground ring to be grounded.