Supporting Case for Multi-Charged Particle Beam Drawing Apparatus
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Solution Overview
Problem
In multi-charged particle beam drawing apparatuses, the high packing density of semiconductor devices requires finer circuit linewidths, leading to increased data transfer needs for blanking plates, which can result in circuit device overheating and gas generation in vacuum environments, causing contamination and malfunctions due to inadequate cooling and electromagnetic interference.
Innovation Solution
A supporting case design that includes a lower and upper case member pinching a mounting substrate, with a pressure-relief valve and heat-conducting elements to manage heat and gas generation, while positioning circuit devices in an airtight space to prevent contamination and electromagnetic interference, using nonmagnetic materials and gold plating to reduce electron scattering and gas generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the amount of data transferred to the blanking plate is increased to control more beams, then the number of beams that can be controlled increases, but the circuit devices generate more heat and may fail to be cooled satisfactorily
Solution Approach 1:
The patent divides the system into two separate vacuum chambers: a first vacuum chamber housing the electron gun and aperture member, and a second vacuum chamber housing the blanking plate and circuit devices. This segmentation isolates the heat-generating circuit devices from the beam-forming components, allowing independent thermal management for each section while maintaining vacuum integrity through a vacuum partition.
Solution Approach 2:
The patent introduces a vacuum partition as an intermediary structure that separates the two vacuum chambers while maintaining vacuum integrity. This partition allows the circuit devices to be positioned in a dedicated space with improved cooling capabilities, acting as a thermal and functional buffer between the beam path and the control electronics.
2Ease of operation
If circuit devices are placed in the vacuum column to control blanking plates, then beam control capability is improved, but gas may be generated from the circuit devices which can contaminate the aperture member
Solution Approach 1:
The patent segments the vacuum system into two separate chambers: the first vacuum chamber contains the aperture member and electron gun, while the second vacuum chamber contains the blanking plate and circuit devices. This physical separation prevents gas generated by circuit devices in the second chamber from contaminating the aperture member in the first chamber, while maintaining independent vacuum integrity through a vacuum partition.
Solution Approach 2:
The patent extracts the circuit devices and blanking plate from the main beam path vacuum chamber and places them in a separate second vacuum chamber. This extraction removes the source of gas contamination (circuit devices) from the sensitive beam-forming region, allowing the aperture member to remain in a cleaner vacuum environment.
3Ease of operation
If circuit devices are made of materials that generate gas in vacuum, then device functionality is maintained, but the generated gas can clog the holes for forming multiple beams
Solution Approach 1:
The patent divides the vacuum system into two separate chambers with the circuit devices isolated in the second chamber. This segmentation ensures that even if the circuit devices generate gas, it remains confined to the second chamber and cannot clog the beam-forming holes in the aperture member located in the first chamber.
Solution Approach 2:
The patent extracts the gas-generating circuit devices from the beam path chamber and relocates them to a separate second vacuum chamber. This extraction prevents the generated gas from reaching and clogging the precisely formed holes in the aperture member, maintaining beam quality while preserving circuit device functionality.
4Productivity
If electrons scattered at the aperture member charge up the circuit devices, then beam interaction is increased, but malfunctions may occur in the circuit devices
Solution Approach 1:
The patent segments the vacuum system into two separate chambers, placing scattered electrons and charged particles in the first chamber while isolating the circuit devices in the second chamber. This segmentation prevents charged particles from reaching and damaging the circuit devices, improving reliability while maintaining beam interaction capabilities in the first chamber.
Solution Approach 2:
The patent extracts the circuit devices from the first vacuum chamber where electron scattering occurs and relocates them to a protected second vacuum chamber. This extraction shields the circuit devices from electron scattering and charge accumulation, preventing malfunctions while preserving the beam-scattering interaction in the original chamber.
5Power
If electromagnetic fields from circuit devices disturb electron beam paths, then power transmission is maintained, but drawing accuracy deteriorates
Solution Approach 1:
The patent divides the vacuum system into two separate chambers, isolating the electromagnetic field-generating circuit devices in the second chamber from the electron beam path in the first chamber. This segmentation prevents electromagnetic fields from disturbing the beam paths, maintaining drawing accuracy while preserving power transmission capabilities in the circuit devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The supporting case effectively cools circuit devices, prevents gas contamination of the aperture member, and reduces electromagnetic interference, enhancing the accuracy and reliability of the multi-beam drawing process by maintaining a stable vacuum environment and efficient heat dissipation.
Implementation Method 1
heat-conducting elements to manage heat and gas generation
Implementation Method 2
pressure-relief valve and heat-conducting elements to manage heat and gas generation
Implementation Method 3
using nonmagnetic materials and gold plating to reduce electron scattering and gas generation
Data Source
AI summary
In one embodiment, a supporting case includes a lower case member and an upper case member. The mounting substrate is pinched between a lower cylindrical supporting portion and a upper cylindrical supporting portion. Peripheral regions of the mounting substrate that are on a peripheral side with respect to a part pinched between the lower cylindrical supporting portion and the upper cylindrical supporting portion are positioned in a space defined by a bottom plate portion, a lower peripheral-wall portion, and the lower cylindrical supporting portion of the lower case member and a top lid portion, an upper peripheral-wall portion, and the upper cylindrical supporting portion of the upper case member.