Supporting Member Stabilizes Tall Semiconductor Lower Electrodes

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Solution Overview

Problem

Semiconductor memory devices face challenges in achieving high capacitance without increasing footprint, as tall lower electrodes are prone to damage or leaning during fabrication, leading to defects.

Innovation Solution

A supporting member is used to stabilize and protect the lower electrodes by enclosing their upper portions and protruding above the electrode surface, ensuring structural stability and preventing damage during fabrication, while a dielectric layer is conformally formed over the electrodes and supporting members.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the height of the lower electrode is increased to achieve high capacitance, then the capacitance increases, but the lower electrode becomes prone to falling down or leaning during fabrication

Engineering Contradiction:

ImprovecapacitanceVSAvoidstructural stability

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

A supporting member is introduced as an intermediary element between the lower electrode and the substrate. This supporting member extends along the sidewall of the lower electrode and provides mechanical support, preventing the tall lower electrode from falling or leaning during fabrication while allowing the electrode to maintain its required height for high capacitance

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The supporting member extends in a direction substantially perpendicular to the substrate, adding vertical support structure. By forming the supporting member to wrap around or contact the sidewall of the lower electrode, the solution utilizes the vertical dimension to provide stability without increasing the horizontal footprint of the capacitor

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If a supporting element is formed to support the lower electrode, then structural stability improves, but the upper edge portion of the lower electrode may be damaged or polymer residue remains causing defects

Engineering Contradiction:

Improvestructural stabilityVSAvoidelectrode integrity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The supporting member is formed to protrude above the upper surface of the lower electrode before the dielectric layer is deposited. This preliminary positioning ensures that the supporting member is already in place to protect the upper edge of the lower electrode during subsequent fabrication steps, preventing damage and polymer residue accumulation at the critical upper edge region

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The supporting member acts as a protective barrier or cushion that precedes potential damage to the lower electrode. By extending above the upper surface of the lower electrode, it provides beforehand protection during fabrication processes, preventing direct exposure of the upper edge to damaging factors such as polymer deposition or mechanical damage

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS8704283B2Semiconductor devices

Publication Date: 2014.04.22 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor device includes a lower electrode, a supporting member enclosing at least an upper portion of the lower electrode, a dielectric layer on the lower electrode and the supporting member, and an upper electrode disposed on the dielectric layer. The supporting member may have a first portion that extends over an upper part of the sidewall of the lower electrode, and a second portion covering the upper surface of the lower electrode. The first portion of the supporting member protrudes above the lower electrode.