Supporting Plate Layout for LED Lamp Boards Under Thermal Stress
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Solution Overview
Problem
The mismatch in thermal expansion coefficients between aluminum plates and glass substrates in LED lamp boards leads to potential damage and reduced quality of electronic devices.
Innovation Solution
Incorporating a supporting plate with a thermal expansion coefficient similar to the substrate, featuring openings for circuit substrates and using adhesive material for attachment, along with thermal conductive materials for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an aluminum plate is attached to the back side of the glass substrate to meet transportation and strength requirements, then the strength and durability of the electronic device are improved, but the mismatch in thermal expansion coefficients between aluminum and glass causes thermal stress that may damage the lamp board
Solution Approach 1:
The patent changes the material parameter (thermal expansion coefficient) by replacing aluminum with an iron-based alloy having a thermal expansion coefficient (10-20×10^-6/℃) closer to that of glass (8-15×10^-6/℃), thereby reducing thermal stress while maintaining structural strength
Solution Approach 2:
The patent uses an iron-based alloy composite material with specific composition (Fe: 70-90%, Ni: 5-15%, Cr: 3-10%, Mn: 2-8%, B: 0.1-0.5%) that combines the strength properties of metal alloys with thermal expansion characteristics compatible with glass substrates
2Strength
If an aluminum plate is used as supporting plate, then the structural support and strength are improved, but the heat dissipation performance is insufficient due to thermal stress and material properties
Solution Approach 1:
The patent optimizes thermal conductivity parameter by selecting iron-based alloy with controlled thermal conductivity (15-30 W/m·℃) that balances heat dissipation capability with thermal expansion compatibility, improving energy efficiency
Solution Approach 2:
The patent applies different materials to different parts: the supporting plate uses iron-based alloy for thermal management while the bonding interface uses adhesive material with specific thermal conductivity (5-15 W/m·℃) to optimize local heat transfer pathways
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the risk of damage to LED lamp boards by minimizing thermal stress and improving heat dissipation, thereby enhancing the durability and performance of electronic devices.
Implementation Method 1
because the coefficient of thermal expansion (CTE) of the aluminum plate differs greatly from that of the glass, it may cause damage to the lamp board
Implementation Method 2
along with thermal conductive materials for enhanced heat dissipation
Data Source
AI summary
An electronic device includes an electronic panel and at least one supporting plate. The electronic panel includes a substrate, an electronic component disposed on a first surface of the substrate, a first circuit substrate, and a second circuit substrate disposed under the substrate. The at least one supporting plate is disposed under the electronic panel and includes a first opening and a second opening. The first circuit substrate and the second circuit substrate respectively pass through the first opening and through the second opening.