Supporting-terminal capacitor chip vibration damping
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Solution Overview
Problem
Existing multilayer ceramic capacitors experience significant vibration due to piezoelectric phenomena, leading to increased acoustic noise when mounted on circuit boards, as the displacement caused by these vibrations is transferred to the board.
Innovation Solution
The use of supporting-terminal-equipped capacitor chips, which incorporate electrically conductive first and second supporting terminals that hold the capacitor chip between them, reducing the transfer of vibration to the circuit board by damping the vibration through strategically positioned connection points and terminal configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive layers are used to connect outer electrodes to terminal frames, then electrical connection is achieved, but vibration is transferred to the circuit board causing acoustic noise
Solution Approach 1:
The patent introduces a resin layer as an intermediary substance between the outer electrode and terminal frame. This resin layer serves dual functions: maintaining electrical connection while acting as a vibration-damping medium that prevents acoustic noise generation, thereby resolving the contradiction between reliable electrical connection and noise reduction
Solution Approach 2:
The patent changes the material parameter of the connection medium from adhesive layer to resin layer. The resin layer has different mechanical properties including vibration-damping characteristics that reduce acoustic noise while maintaining the necessary electrical connection, thus resolving the contradiction
2Reliability
If terminal frames are used to connect outer electrodes, then electrical connection is established, but capacitor chip displacement occurs due to piezoelectric phenomenon
Solution Approach 1:
The resin layer acts as an intermediary between the outer electrode and terminal frame, absorbing the displacement forces generated by piezoelectric phenomenon while maintaining electrical connection. This prevents capacitor chip displacement while ensuring reliable electrical connection
Solution Approach 2:
The patent changes the connection medium from rigid adhesive layers to a resin layer with appropriate mechanical compliance. This resin layer can accommodate the displacement caused by piezoelectric effect while maintaining electrical connection, thus resolving the stability issue
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the acoustic noise generated by minimizing the vibration propagation from the capacitor chip to the circuit board, achieving a sound pressure level reduction of about 20 dB compared to traditional multilayer ceramic capacitors with terminal frames.
Implementation Method 1
a first supporting terminal and a second supporting terminal that hold the capacitor chip between the first supporting terminal and the second supporting terminal... reducing the transfer of vibration to the circuit board by damping the vibration
Implementation Method 2
vibration of the capacitor chip generated due to the piezoelectric phenomenon
Data Source
AI summary
A supporting-terminal-equipped capacitor chip includes a capacitor chip, and first and second supporting terminals that are electrically conductive and hold the capacitor chip therebetween. A portion of the capacitor chip other than a first connection portion and the first supporting terminal are separated from each other. A portion of the capacitor chip other than a second connection portion and the second supporting terminal are separated from each other. The first connection portion is located on the first main surface adjacent to a first end surface. The second connection portion is located on the first main surface adjacent to a second end surface.