Supportive Plating Structure for Semiconductor Heat and Warpage
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Solution Overview
Problem
Semiconductor devices face challenges with excessive heat generation and warpage due to thermal expansion, especially during assembly processes like reflow soldering, where existing solutions are ineffective prior to or during soldering.
Innovation Solution
The semiconductor device package incorporates a substrate with a semiconductor die and a thermally conductive plate coupled to the die, featuring pins and channels for enhanced heat dissipation and structural support to prevent warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If semiconductor devices are exposed to high temperatures during assembly (reflow soldering), then soldering can be completed, but warping occurs due to differential thermal expansion of components
Solution Approach 1:
The patent applies preliminary action by providing support structures (pins and channels) to the semiconductor device package before the soldering process. These support structures are positioned in advance to counteract the warping forces that will occur during thermal expansion in the reflow soldering process, thereby preventing warpage before it happens rather than correcting it afterward
2Volume of moving object
If package size is decreased to meet miniaturization requirements, then device compactness is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent applies dimensionality change by implementing vertical heat dissipation pathways through channels that extend through the semiconductor die from top to bottom. This allows heat to be conducted in the vertical dimension (z-axis) rather than relying solely on lateral heat spread, enabling effective heat dissipation in miniaturized packages where lateral expansion is constrained
3Stability of the object's composition
If support structures are added to prevent warping, then structural stability is improved, but device complexity increases
Solution Approach 1:
The patent applies multi-functionality by designing the support structures (pins and channels) to serve multiple functions simultaneously: they provide mechanical support to prevent warping during assembly, establish thermal contact pathways for heat dissipation, and maintain structural integrity throughout the packaging process. This consolidation of functions reduces the need for separate dedicated components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat and reduces warpage by providing a robust thermal management system and structural reinforcement, thereby improving the reliability and performance of semiconductor devices.
Implementation Method 1
a plate coupled to a top surface of the semiconductor die, and at least one pin projecting from the plate toward the first substrate
Implementation Method 2
different components of semiconductor devices often are made of materials having varying coefficients of thermal expansion (CTE). As such, when exposed to high temperatures or excess heat (e.g., during reflow soldering), some of the components may expand more than other components resulting in a warping of the semiconductor device
Data Source
AI summary
A semiconductor package includes a substrate having a first surface, and a second surface opposite the first surface. The substrate includes a connection region having a first array of contact pads, and a peripheral region surrounding the connection region and having additional contact pads. A semiconductor die having an array of electrical contacts and thermal contacts, is connected to the first array of contact pads and to the additional contact pads. A plate is coupled to a top surface of the semiconductor die and there is at least one pin projecting from the plate toward the first substrate. The pin is disposed within a channel that extends between the plate and the additional contact. The plate, channel and pin improve the heat dissipation capabilities of the semiconductor device package.