Supra-Aural Earphone Dual-Layer PCB Layout for Circuit Expansion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Ear hook headphones face the challenge of integrating more circuits within a limited device space without increasing volume or weight, which affects wearing comfort and stability.
Innovation Solution
A dual-layer circuit board structure is implemented, utilizing vertical space in the circuit board compartment with a first and second circuit board connected via a connector, and optionally using a flexible circuit board for foldable connection, along with signal shielding and conductive buffer pads to enhance electrical connection and reduce electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If circuit expansion is achieved through hardware circuits, then functional demands are met, but circuit area increases and device volume increases
Solution Approach 1:
The patent transitions from a single-layer circuit board to a dual-layer circuit board structure, utilizing the vertical dimension (thickness direction) to expand circuit area. The first and second circuit boards are arranged in parallel along the thickness direction of the housing, allowing circuit expansion without increasing the length or width of the device, thus meeting functional demands while controlling device volume.
2Adaptability or versatility
If circuit expansion is achieved through hardware circuits, then functional demands are met, but circuit area increases and device weight increases
Solution Approach 1:
By utilizing the vertical dimension to arrange circuit boards in dual layers, the patent achieves circuit expansion without proportionally increasing device weight. The connector design with contact pieces and contact holes enables efficient space utilization, allowing more circuits to be integrated within the same volume, thereby reducing weight increase compared to horizontal expansion approaches.
3Area of stationary object
If dual-layer circuit board structure is implemented, then circuit area is expanded within limited space, but device complexity increases
Solution Approach 1:
The patent divides the circuit board into two separate layers (first circuit board and second circuit board) connected via a connector. This segmentation allows each layer to be designed and manufactured independently, simplifying the overall design process while achieving expanded circuit area. The connector acts as an intermediary that manages the complexity of inter-layer connections.
Solution Approach 2:
The connector serves as an intermediary component between the first and second circuit boards. It includes contact pieces extending from the first circuit board through contact holes to contact pads on the second circuit board, facilitating electrical connections while managing the complexity of the dual-layer structure. This intermediary approach simplifies the integration process and maintains design modularity.
Data Source
Figure 1~2
Figure 3~5
AI summary
This specification provides a headphone, the headphone is provided with a dual-layer circuit board structure within the circuit board compartment, so that the vertical space of the circuit board compartment perpendicular to the first circuit board surface is fully utilized, thereby meeting more circuit expansion requirements without expanding the circuit board compartment, such as requirements for storage and playback of audio data. Furthermore, the headphone provided by this specification can use other models of headphone housing, without the need to redesign and re-mold, thereby reducing development and production costs.