Surface-Coated Titanium Oxide Resin for Low-Loss PCB Insulation
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Solution Overview
Problem
Conventional insulation layers in printed wiring boards face challenges with high permittivity leading to increased dielectric loss, void formation, and delamination due to moisture evaporation during reflow operations, necessitating a material with high permittivity, low dissipation factor, and improved heat and moisture resistance.
Innovation Solution
A resin composition comprising surface coated titanium oxide with a low mass reduction rate and a thermosetting compound, optionally with an organic and/or inorganic oxide layer, is used to enhance permittivity, reduce dissipation factor, and improve heat and moisture resistance, inhibiting void formation and delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a filler having high relative permittivity is blended to increase the relative permittivity of an insulation layer, then the relative permittivity is improved, but the dissipation factor simultaneously increases, resulting in higher transmission loss of higher frequency signals
Solution Approach 1:
The patent changes the surface properties of the filler particles by coating them with specific substances (silane coupling agents, inorganic oxide layers, or organic layers). This parameter change in surface characteristics allows the high permittivity filler to maintain its dielectric performance while reducing the dissipation factor, resolving the contradiction between high permittivity and low energy loss.
Solution Approach 2:
The patent creates a composite filler structure by combining the high permittivity filler core with surface coating layers (silane coupling agents, inorganic oxides, or organics). This composite approach allows the inner core to provide high permittivity while the outer coating layers suppress the dissipation factor, achieving both high relative permittivity and low dissipation factor simultaneously.
2Reliability
If filler is used to produce an insulation layer with high permittivity and low dissipation factor, then the dielectric characteristics are improved, but voids form and delamination occurs, resulting in poor heat resistance
Solution Approach 1:
The patent introduces surface coating layers (silane coupling agents, inorganic oxide layers, or organic layers) as intermediary substances between the filler particles and the resin matrix. These intermediary coating layers improve the interface bonding, prevent void formation, and enhance heat resistance while maintaining the dielectric characteristics provided by the filler core.
Solution Approach 2:
The patent applies thin film coating layers (silane coupling agents, inorganic oxide layers, or organic layers) around the filler particles. These flexible coating films prevent direct contact between the filler surface and resin, eliminating voids and improving heat resistance while preserving the high permittivity and low dissipation factor properties of the filler core.
3Ease of manufacture
If an insulation layer has low moisture absorption and heat resistance, then the material properties are simplified, but moisture evaporates during reflow operation, forming voids and causing delamination
Solution Approach 1:
The patent changes the surface properties of the filler particles through coating with silane coupling agents, inorganic oxide layers, or organic layers. This parameter change in surface characteristics increases moisture absorption capability and heat resistance, preventing moisture evaporation during reflow operations while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves high permittivity and low dissipation factor with excellent heat and moisture resistance, preventing voids and delamination, ensuring favorable dielectric characteristics and reliability in printed wiring boards.
Implementation Method 1
a surface coated titanium oxide in which a mass reduction rate in heating from 30° C. to 300° C. at a heating rate of 10° C./min is 0.5 mass % or less
Implementation Method 2
the higher a frequency of a signal used, the greater a dielectric loss becomes. An increase in the dielectric loss dampens an electrical signal
Implementation Method 3
the surface coated titanium oxide (A) has an organic layer and/or an inorganic oxide layer on the surface of a titanium oxide particle
Data Source
AI summary
An object is to provide a resin composition having a high permittivity and a low dissipation factor, and having excellent heat resistance and moisture absorption and heat resistance, and suitably used for producing an insulation layer of a printed wiring board, and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board obtainable by using the resin composition. The resin composition of the present invention contains (A) a surface coated titanium oxide in which a mass reduction rate in heating from 30° C. to 300° C. at a heating rate of 10° C./min is 0.5 mass % or less, and (B) a thermosetting compound.