Surface Coating Method Using Adhesion Promoter for Strong Deposits
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Solution Overview
Problem
Current methods for coating surfaces, particularly conductive or semiconductive surfaces, face challenges in achieving strong and adhesive deposits of materials like polymers and metals due to differences in electronic structures, leading to issues with adhesion, uniformity, and stability under working conditions.
Innovation Solution
A process involving the placement of a first material on a surface, followed by the insertion and conversion of a precursor for a second material within the first material, allowing for the formation of a strong adhesive bond through electrochemical layering, which can include electrografting and electrodeposition techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional coating methods are used on conductive or semiconductive surfaces, then the coating process can be performed, but the adhesion of the deposit to the surface is poor
Solution Approach 1:
The patent introduces an intermediary substance (adhesion promoter or primer) that mediates between the conductive/semiconductive surface and the coating material. This intermediary contains functional groups that can bond to both the surface and the coating, creating a strong adhesive interface. The intermediary layer resolves the incompatibility between the surface electronic structure and the coating material, enabling reliable adhesion without compromising stability under working conditions.
2Strength
If complex pretreatments like plasma or CVD are applied to improve adhesion, then the deposit adheres better, but the process complexity and cost increase
Solution Approach 1:
The patent applies preliminary action by pre-modifying the surface or pre-preparing an adhesion promoter layer before the main coating process. Instead of using complex in-situ treatments like plasma or CVD during coating, the surface is pre-treated with a simple chemical modification or primer application that creates favorable bonding conditions. This preliminary preparation simplifies the overall process while ensuring strong adhesion, avoiding the need for complex equipment and multi-step procedures.
3Ease of manufacture
If functionalization methods are used to attach molecules to surfaces, then the desired material can be deposited, but the chemical integrity of precursors is compromised
Solution Approach 1:
The patent uses an intermediary adhesion promoter that acts as a chemical bridge without compromising the integrity of the coating precursors. This intermediary contains reactive functional groups that bond to the surface and stable groups that accommodate the coating material. By using this intermediary, the patent achieves easy material attachment while preserving the chemical integrity of the precursors, avoiding degradation or unwanted side reactions that would compromise composition stability.
4Strength
If reactive deposition treatments are applied to metal surfaces, then attachment to oxide layers is improved, but the method does not work on clean metal surfaces without localized states
Solution Approach 1:
The patent achieves universality by developing a coating method that works on multiple surface types (clean metals, oxidized surfaces, semiconductors) through a universal adhesion promotion mechanism. The adhesion promoter contains functional groups that can interact with different surface chemistries and electronic structures, making the method universally applicable. This universal approach allows the same coating process to succeed on diverse substrates without requiring surface-specific treatments or modifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process enables the creation of very adhesive and reproducible deposits of materials on various surfaces, improving adhesion and stability, and is applicable to a wide range of materials including polymers and metals, even on surfaces where traditional methods fail.
Implementation Method 1
placing the first material on a surface
Implementation Method 2
inserting into the first material a precursor of a second material
Implementation Method 3
converting the precursor of the second material inserted into the first material into the second material such that this second material becomes formed on the surface to be coated and within the first material placed on the surface
Data Source
AI summary
The invention relates to the deposition or attachment of materials to surfaces. It relates to a process for coating a surface with a first material and a second material, comprising the following steps:placing the first material on the said surface,inserting into the first material placed on the said surface precursor molecules of the second material,converting the said precursor molecules of the second material inserted into the first material into the said second material such that this second material becomes formed on the said surface to be coated and within the said first material placed on the said surface.The object of the process of the invention is to allow the deposition of materials of any type onto surfaces of any type.