Surface-Cooled Fume Trap for Semiconductor Heat Treatment
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Solution Overview
Problem
Fumes generated during substrate heat treatment in semiconductor manufacturing processes contaminate auxiliary devices and can cause process failures by flowing into cooling systems and vacuum pumps.
Innovation Solution
An apparatus for trapping fumes includes a fume trapping unit with a cooling unit in surface-contact, a pressure sensor, and a system for processing substrates that efficiently removes fumes and improves cooling performance by using a refrigerant flow path and pressure monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional fume trapping system is used without surface-contact cooling, then the device structure is simpler, but the cooling performance and fume removal efficiency are insufficient
Solution Approach 1:
The cooling unit is merged with the fume trapping unit through surface-contact, where the cooling unit includes a cooling plate that directly contacts the outer surface of the fume trapping unit. This integration allows the cooling system to be embedded within the fume trapping structure, improving cooling performance while maintaining structural compactness rather than adding separate external cooling components
Solution Approach 2:
A cooling plate acts as an intermediary component between the refrigerant circulation system and the fume trapping unit. The cooling plate receives refrigerant from the refrigerant supply line and transfers cooling效果 to the fume trapping unit through thermal conduction, enabling efficient heat removal without direct exposure of refrigerant components to the fume environment
2Reliability
If fumes are allowed to flow into auxiliary devices, then the system operation is simpler, but atmosphere contamination and process failure occur
Solution Approach 1:
The fume trapping unit is positioned and configured to intercept fumes at their source before they can reach auxiliary devices. The unit includes flow paths and trapping mechanisms that actively capture fumes during the substrate heating process, preventing contamination of cooling water supply devices, vacuum pumps, and other auxiliary equipment before harm occurs
Solution Approach 2:
A pressure sensor is integrated into the fume trapping unit to monitor pressure differential across the trapping system. This feedback mechanism detects changes in fume flow conditions and allows for real-time monitoring of system performance, enabling timely maintenance or adjustments to ensure continuous effective fume removal and protect process reliability
3Ease of repair
If pressure monitoring is not implemented, then the device structure is simpler, but maintenance timing cannot be optimized
Solution Approach 1:
The pressure sensor provides continuous feedback on the pressure differential across the fume trapping unit, which correlates with fume flow rate and system resistance. By monitoring pressure changes over time, the system can detect when filters or trapping media become saturated or blocked, indicating when maintenance is needed, thereby optimizing maintenance scheduling without requiring complex diagnostic systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively removes fumes, enhances cooling efficiency, and maintains device performance by trapping and cooling fumes, preventing contamination and process failures.
Implementation Method 1
a cooling unit disposed to be in surface-contact with one surface of the fume trapping unit
Implementation Method 2
a second flow path for a refrigerant for cooling the airflow to move
Data Source
AI summary
An apparatus for trapping fumes includes a fume trapping unit including a first flow path for an airflow including fumes to move, a first inlet configured to allow the airflow to flow into the first flow path, and a first outlet configured to discharge the airflow from the first flow path; a cooling unit including a second flow path for refrigerant for cooling the airflow to move, a second inlet configured to allow the refrigerant to flow into the second flow path, and a second outlet configured to discharge the refrigerant from the second flow path; and a pressure sensor configured to measure pressure in the first flow path, wherein the cooling unit is disposed to be in surface-contact with one surface of the fume trapping unit.