Surface Discharge Electrodes via Segmented Wire Network
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The production of large-area surface discharge electrodes via electroplating on non-metallic substrates is challenging due to issues with uniform deposition and mechanical tension in wire frames, which leads to difficulties in achieving homogeneously distributed contact points and efficient metal film thickness.
Innovation Solution
A method involving a network of mutually movable metal wire filaments arranged to form an electrically percolating wire network, embedded in a gel matrix, which is applied to the substrate and wetted with a solvent for improved contact and uniform electroplating, allowing for the production of a semi-finished product that can be stored and transported easily.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wire frame is used to contact the seed layer, then electrical contact is achieved, but mechanical tension causes non-uniform distribution of contact points
Solution Approach 1:
The wire frame is segmented into multiple individual wire elements that are distributed across the substrate surface. This segmentation allows each wire to independently contact the seed layer at multiple points, ensuring uniform electrical contact distribution while eliminating mechanical tension issues associated with continuous frames.
Solution Approach 2:
The wire elements are designed with specific local properties including optimal diameter, length, and spacing to ensure uniform contact pressure and electrical contact. Each wire element is tailored to provide consistent local contact quality across the entire substrate surface, addressing the uniformity issue.
2Productivity
If electroplating is performed at high current densities, then deposition rate increases, but deposition uniformity across the seed layer deteriorates
Solution Approach 1:
The wire elements create localized high current density zones at each contact point with the seed layer. This local quality approach allows the overall deposition process to maintain uniformity across the substrate while achieving high deposition rates at each individual contact zone, resolving the contradiction between productivity and uniformity.
Solution Approach 2:
The current delivery system is segmented into multiple independent wire elements distributed across the substrate. This segmentation enables each wire to operate at high current density independently, achieving high overall deposition rate while maintaining uniform distribution of metal deposition across the entire seed layer surface.
3Quantity of substance
If thin metal films are used for surface discharge electrodes, then material usage is reduced, but electrical resistance becomes too high
Solution Approach 1:
The electrode structure is segmented into a three-layer system: thin seed layer, intermediate metal film, and wire element network. This segmentation allows the thin metal film to serve as an efficient intermediate layer that bridges the seed layer and wire elements, achieving low overall resistance while minimizing total metal consumption.
Solution Approach 2:
The electrode is constructed as a composite structure combining thin metal film with wire element network. This composite approach compensates for the high resistance of thin films by incorporating conductive wire elements, achieving the desired electrical conductivity without increasing metal film thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the production of large-area surface discharge electrodes by ensuring uniform deposition and increased metal film thickness, while allowing for efficient transportation and storage of the semi-finished product, and results in a stable, conductive surface with reduced mechanical tension issues.
Implementation Method 1
the dried gel matrix with the metal wire network embedded therein is applied to the substrate and wetted with a solvent for the gel matrix
Implementation Method 2
Electrodeposition of a metal film from the electrolyte at least on the seed layer
Implementation Method 3
metal ions in the electrolyte are reduced by adding a reducing agent and deposited on the substrate surface as element metal
Implementation Method 4
electrically contacting the seed layer with a metal wire network
Data Source
Figure 1
Figure 2
AI summary
The invention relates to a method for producing metallic surface electrodes on non-metallic substrates, comprising the steps of: a. generating a metallic nucleation layer on a substrate; b. electrically contacting the nucleation layer with a metal wire network and an electrolyte containing metal ions; c. galvanically depositing a metal film from the electrolyte, at least on the nucleation layer, embedding the metal wire network in the metal film, wherein d. mutually movable metal wire filaments are arranged to form an electrically percolating metal wire network; e. casting the arrangement of the metal wire filaments into a gel matrix and subsequently drying the gel matrix; and f. applying the dried gel matrix with the embedded metal wire network to the substrate and wetting it with a solvent from the gel matrix. The invention further relates to a semi-finished product for carrying out the method.