Surface Light Emitter Structure for Accurate Bump Bond Alignment
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Solution Overview
Problem
Existing surface emitting elements lack position controllability of the bump when bonding the electrode and substrate via a bump, leading to potential positional deviation and element destruction due to biased current paths or local stress.
Innovation Solution
The surface emitting element incorporates a convex portion in the second semiconductor structure that protrudes beyond the external joint surface, providing position controllability during bump bonding, with a stacked structure of insulating films and wirings forming a step portion around the light emitting region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an electrode and substrate are bonded via a bump without position control features, then the bonding process is simple, but positional deviation occurs leading to element destruction
Solution Approach 1:
The convex portion is formed in advance on the second structure before the bump bonding process. This preliminary structural feature serves as a position control reference that guides the bump to the correct location during bonding, preventing positional deviation without adding complex real-time control mechanisms.
Solution Approach 2:
The convex portion acts as an intermediary element between the second structure and the bump. It provides a physical reference surface that mediates the positioning process, ensuring accurate alignment during bonding while maintaining simplicity in both the electrode and substrate designs.
2Manufacturing precision
If no position control feature is provided, then the manufacturing process is simpler, but alignment accuracy during bump bonding deteriorates
Solution Approach 1:
The convex portion is formed during the semiconductor manufacturing process as a preliminary feature on the second structure. This approach integrates position control into the existing manufacturing flow without requiring additional complex manufacturing steps, thereby maintaining ease of manufacture while improving alignment accuracy.
Solution Approach 2:
The convex portion provides localized position control only at the critical bonding interface where it is needed. The rest of the structure maintains its original simple design, thus improving manufacturing precision at the joint surface without complicating the overall manufacturing process.
3Measurement precision
If the convex portion protrudes beyond the external joint surface, then position controllability is improved, but the structure becomes more complex
Solution Approach 1:
The convex portion is formed as a preliminary feature during the semiconductor manufacturing process, serving as a pre-established position reference. This approach achieves precise position control without adding complex real-time measurement or adjustment mechanisms during the bonding process.
Solution Approach 2:
The convex portion provides self-aligning functionality during bump bonding. The protruding structure automatically guides the bump to the correct position through physical contact, eliminating the need for external positioning systems or complex control mechanisms.
Data Source
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AI summary
A surface emitting element having position controllability of a bump when an electrode and a substrate are bonded via the bump is provided. A surface emitting element according to the present technology is a surface emitting element including: a first structure including a first semiconductor structure; a second structure stacked with the first structure and including a second semiconductor structure; and a light emitting layer arranged between the first structure and the second structure and including a light emitting region, in which the second structure further includes an electrode including a bump joint surface on a side opposite to a side of the light emitting layer of the second semiconductor structure, and a convex portion protruding to the side opposite to the side of the light emitting layer more than the bump joint surface is provided. According to the surface emitting element according to the present technology, a surface emitting element having position controllability of a bump when an electrode and a substrate are bonded via the bump is provided.