Surface-Emitting Laser Arrays for Precise Digital Heat Injection

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Solution Overview

Problem

Conventional edge-emitting laser diodes face challenges in manufacturing precision, high production costs, and limited power output due to wavelength variability and complex mounting requirements, which hinder the commercialization of digital heat injection technology.

Innovation Solution

The use of surface-emitting laser diodes that emit radiation orthogonally to the manufacturing wafer plane, eliminating the need for precise edge alignment and reducing energy density, allowing for high-power output with simpler cooling and mounting configurations, and achieving precise wavelength control with minimal temperature-dependent output variation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If edge-emitting laser diodes are used for digital heat injection, then wavelength precision can be achieved, but manufacturing complexity and production costs increase significantly

Engineering Contradiction:

Improvewavelength precisionVSAvoidmounting complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent inverts the conventional edge-emitting approach by using surface-emitting laser diodes that emit perpendicular to the wafer surface. This eliminates the need for complex edge alignment and facet protection mechanisms, thereby reducing manufacturing complexity while maintaining wavelength precision through controlled semiconductor material composition and layer structure.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The invention extracts and eliminates the problematic edge-emitting facet from the design. By removing the need for precise edge alignment and facet protection components, the system simplifies the mounting process while preserving the essential wavelength precision function through the semiconductor active region design.

Inventive Principle:

Principle #2Taking out (Extraction)

2Power

If edge-emitting laser diodes are used to achieve high power output, then energy density increases, but cooling requirements and manufacturing difficulty increase

Engineering Contradiction:

Improvepower outputVSAvoidmanufacturing ease

Core Design Contradiction:

PowerVSEase of manufacture

Solution Approach 1:

The patent transitions from edge-emitting (lateral dimension) to surface-emitting (perpendicular dimension) geometry. This dimensional change allows for more effective heat dissipation through the substrate and simplifies the mounting structure, enabling high power output without proportionally increasing manufacturing difficulty.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The invention incorporates cooling channels and heat dissipation structures into the mounting substrate before the laser diodes are mounted. This preliminary preparation of the thermal management system simplifies the overall manufacturing process and enables high power operation without requiring complex post-assembly cooling solutions.

Inventive Principle:

Principle #10Preliminary action

3Measurement precision

If conventional laser diodes are used, then wavelength control is achieved, but temperature-dependent wavelength variation remains significant

Engineering Contradiction:

Improvewavelength controlVSAvoidwavelength stability

Core Design Contradiction:

Measurement precisionVSStability of the object's composition

Solution Approach 1:

The patent modifies the physical parameters of the semiconductor material, including composition ratios, layer thicknesses, and crystal structure, to create an active region that is less sensitive to temperature variations. This changes the fundamental temperature-wavelength relationship, improving wavelength stability while maintaining precise wavelength control capability.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces production costs, increases reliability, and enables efficient, high-yield manufacturing of digital heat injection systems with improved cooling and zone control, making the technology more economically viable for commercial applications.

Implementation Method 1

at least one semi-conductor based narrowband radiation emitting device element, the at least one narrowband radiation emitting device being operative to emit radiation at a narrow wavelength band of radiant heat output

Methodology Applied

Scientific EffectLaser emission: Laser

Implementation Method 2

matching the wavelength of irradiation to a particular wavelength at which the target has an absorption coefficient that is the most desirable for the desired application result

Methodology Applied

Scientific EffectAbsorption spectrum matching: Absorption Spectroscopy

Implementation Method 3

the at least one narrowband radiation emitting device being mounted to a mounting entity comprising at least one of a circuit board and a cooling substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9282851B2Digital heat injection by way of surface emitting semi-conductor devices

Publication Date: 2016.03.15 PRESSCO IP LLC

AI summary

A method and system are provided for digitally injecting heat into a wide range of products by way of incorporation of a special class of semi-conductor lasers, e.g. surface emitting devices. This technique relates to a more specific, economical, and advantageous way of practicing the art of directly injecting narrowband radiant energy that desirously matches the absorption specification of a particular material at a specified wavelength.