Surface-Emitting Laser Package Layout Without Wire Bonding
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Solution Overview
Problem
Current surface emitting laser packages face challenges such as electrical disconnection, moisture ingress, heat dissipation issues, and increased size due to wire bonding, which affect reliability and light output.
Innovation Solution
A surface emitting laser package design featuring a housing with a step and diffusion part, conductive lines, and connection pads and lines with varying widths to minimize obstruction, combined with adhesive parts for secure attachment and reduced wire usage, ensuring reliable electrical connections and improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used for electrical connection, then electrical connection reliability is improved, but package size increases and manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates the wire bonding process from the package structure. Instead of using separate wires for electrical connection, the invention integrates the electrical connection function directly into the substrate through conductive lines and connection pads, removing the need for additional wire bonding components and processes.
Solution Approach 2:
The patent merges the electrical connection function with the substrate structure itself. The substrate is designed to include integrated conductive lines and connection pads that directly provide electrical pathways, combining what were previously separate functions (substrate support and wire bonding) into a unified integrated structure.
2Reliability
If wire bonding is used for electrical connection, then electrical connection reliability is improved, but device complexity increases
Solution Approach 1:
The patent removes the wire bonding process from the manufacturing sequence, eliminating the associated equipment, materials, and process steps. This extraction simplifies the overall manufacturing complexity while maintaining electrical connection functionality through the integrated substrate design.
Solution Approach 2:
The invention combines multiple functions (mechanical support, electrical connection, and signal transmission) into the single substrate component with integrated conductive pathways. This merging reduces the total number of components and assembly steps, thereby reducing device complexity.
3Reliability
If housing with step and diffusion part is used, then moisture ingress is prevented and reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The housing is segmented into distinct functional regions including a step portion and a diffusion part. This segmentation allows each region to perform its specific function (protection, light diffusion) while being manufactured as an integrated component, balancing protective functionality with manufacturing efficiency.
Solution Approach 2:
The housing structure is designed to perform multiple functions simultaneously: mechanical protection of the laser element, moisture barrier, and light diffusion. This multi-functionality reduces the need for separate components, thereby maintaining ease of manufacture while achieving reliable moisture protection.
4Illumination intensity
If connection lines with varying widths are used, then light output obstruction is minimized, but manufacturing precision requirements increase
Solution Approach 1:
The conductive lines are designed with varying widths according to their specific functional requirements. Lines in regions where light transmission is critical have narrower widths to minimize obstruction, while lines in non-critical regions can be wider for better electrical performance. This local quality approach optimizes light output while managing manufacturing precision requirements.
Data Source
AI summary
In a surface emitting laser package, a surface emitting laser element and a substrate may be electrically connected through a diffusion part. In detail, according to the surface emitting laser package, a housing includes a step, the diffusion part is disposed at the step of the housing, and the surface emitting laser element and the substrate may be electrically connected through a connection wiring extending through the housing to correspond to the step and a conductive line disposed at one side of the diffusion part.