Surface Layer Power Routing for Printed Wiring Boards
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge is to reduce the number of layers in a printed wiring board while minimizing power supply potential fluctuations and radiation noise when mounting an LSI that requires multiple power supplies, as existing technologies struggle to eliminate the power supply layer and prevent main power supply patterns from crossing, which is necessary for reducing impedance and noise.
Innovation Solution
A printed circuit board design featuring a semiconductor package mounted on a surface layer of the printed wiring board with multiple main power supply patterns and power supply patterns formed on the surface layer, connected in a single stroke manner to avoid crossing and eliminate the need for an inner power supply layer, thereby reducing the number of layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If power supply patterns are formed on the surface layer together with signal wiring patterns, then the number of layers is reduced, but the power supply patterns cross each other causing short-circuits between different DC voltages
Solution Approach 1:
The patent divides the power supply terminal connections into multiple groups (first power supply terminal group, second power supply terminal group, etc.) and assigns different wiring patterns to each group. The first wiring pattern connects terminals in the first group, while the second wiring pattern connects terminals in the second group, preventing crossings between different voltage lines.
Solution Approach 2:
The patent utilizes the circumferential direction around the semiconductor element as an additional spatial dimension for routing. By arranging power supply terminals in concentric groups and routing wirings in the circumferential direction, the design allows multiple power supply patterns to coexist on the surface layer without crossing, effectively using spatial arrangement to resolve the contradiction.
2Adaptability or versatility
If multiple main power supply patterns are formed to support different DC voltages, then multiple power supplies are enabled, but the patterns must not cross each other increasing wiring complexity
Solution Approach 1:
The patent segments power supply terminals into multiple groups based on their voltage requirements. Each group is connected by dedicated wiring patterns that do not cross other voltage lines, simplifying the routing arrangement while supporting multiple DC voltages.
Solution Approach 2:
The patent uses the circumferential direction and radial distance from the semiconductor element as organizing dimensions. Terminals at different radial distances form different groups, and wirings follow concentric paths in the circumferential direction, enabling clear separation of multiple voltage lines without complex routing.
Data Source
AI summary
On a surface layer of a printed wiring board, main power supply patterns to be applied with different DC voltages are disposed in a second region. Power supply patterns are disposed on the surface layer, and the power supply patterns are led from the main power supply patterns to a first region. The power supply patterns connect power supply terminals of terminal groups in the second region. The power supply patterns connect the power supply terminals between the terminal groups in the first region. Power supply terminals of the terminal groups of a semiconductor package are electrically connected to the main power supply patterns by the power supply patterns. Thus, potential fluctuations are reduced and radiation noise is suppressed, and the number of layers of the printed wiring board is reduced.