Surface-Mounted Magnetic Module With Overmolded Isolation
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Solution Overview
Problem
There is a need for smaller, more efficient, and lower-cost transformers that operate with reduced power consumption, particularly in applications like telecommunications and medical devices, where traditional transformers are inefficient and costly.
Innovation Solution
The development of a magnetic-component module comprising a substrate, a core, a spacer, wire bonds, and a lead frame, with an overmold material encapsulating the core, spacer, and lead frame, which supports the core and electrically connects the winding to the substrate, allowing for reduced size and power consumption while maintaining performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional transformers are used, then voltage transformation function is achieved, but size is large and cost is high
Solution Approach 1:
The transformer is divided into separate functional components: magnetic core, windings, spacer, and overmold material. This segmentation allows each component to be optimized independently and assembled into a compact module, reducing overall size while maintaining performance.
Solution Approach 2:
The transformer design transitions from traditional three-dimensional bulky structure to a planar substrate-based configuration. The magnetic core is positioned on a substrate with windings arranged in a two-dimensional layout, enabling compact integration and reduced volume.
2Use of energy by moving object
If transformer size is reduced, then power consumption decreases, but manufacturing complexity increases
Solution Approach 1:
The substrate serves multiple functions: mechanical support for the magnetic core, electrical connection path for windings, and mounting platform for the entire transformer module. This multi-functionality reduces the need for additional components and simplifies manufacturing.
Solution Approach 2:
Multiple transformer components (magnetic core, windings, spacer, and overmold material) are combined into a single integrated module that mounts directly onto the substrate. This merging reduces assembly steps and manufacturing complexity while maintaining compact size.
3Adaptability or versatility
If compact module design is implemented, then integration is improved, but isolation between components may be compromised
Solution Approach 1:
The overmold material acts as an intermediary substance that fills gaps and provides electrical isolation between adjacent windings and between windings and the substrate. This mediator enables compact integration while preventing harmful electrical short circuits.
Solution Approach 2:
The overmold material forms a flexible insulating layer that conforms to the three-dimensional arrangement of transformer components. This thin film provides effective electrical isolation without requiring large clearance distances, enabling compact design with maintained safety.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the creation of compact, efficient, and cost-effective magnetic-component modules suitable for various applications, including voltage converter circuits and motor control systems, with improved isolation and reduced risk of short circuits, achieving high efficiency and reliability.
Implementation Method 1
The primary winding(s) receive electrical energy, such as from a power source, and couples this energy to the secondary winding(s) by a changing magnetic field
Implementation Method 2
an overmold material encapsulating the core, the spacer, the wire bonds, and a portion of the lead frame
Data Source
AI summary
A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, a lead frame that supports the core and that electrically connects the winding to the substrate, and an overmold material encapsulating the core, the spacer, the wire bonds, and a portion of the lead frame.