Surface-Mounted Magnetic Module With Wire-Bonded Planar Transformer
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Solution Overview
Problem
There is a need for smaller, more efficient, and lower-cost transformers that operate with reduced power consumption, particularly in applications such as telecommunications, implantable medical devices, and battery-operated wireless devices, where existing transformers are often large and inefficient.
Innovation Solution
A magnetic-component module design featuring a core on a substrate with a gap between the core and the substrate, a spacer over the core, wire bonds extending over the spacer and core, and an overmold material encapsulating the components, along with optional lead frames and adhesive for stabilization and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional transformer designs are used, then voltage transformation function is achieved, but the size is large and power consumption is high
Solution Approach 1:
The patent transitions from traditional three-dimensional bulky transformer structures to a two-dimensional planar configuration where windings are arranged on a substrate in a flat layout. This dimensional change enables significant reduction in volume while maintaining electrical functionality, directly addressing the contradiction between size and energy efficiency.
Solution Approach 2:
The patent integrates multiple transformer components (core, windings, insulation, and substrate) into a single unified planar module. By merging these elements into one compact structure rather than assembling separate components, the overall size is reduced and manufacturing efficiency is improved, resolving the size-power consumption contradiction.
2Volume of moving object
If transformer size is reduced, then space is saved, but manufacturing complexity increases
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides mechanical support for the windings, acts as an insulating layer, serves as a mounting platform for the core, and facilitates electrical connections. This multi-functionality reduces the need for separate structural components, simplifying manufacturing despite the compact design.
Solution Approach 2:
The transformer is divided into distinct functional layers on the substrate (core region, winding regions, insulation layers, connection terminals), allowing each segment to be manufactured and assembled independently. This segmentation simplifies the manufacturing process while maintaining the compact overall structure.
3Volume of moving object
If compact design is implemented, then volume is reduced, but risk of short circuits increases
Solution Approach 1:
Insulation layers are introduced as intermediary elements between conductive components (windings and core). These insulation layers act as mediators that prevent direct contact between conductors, eliminating short circuit risks while allowing the components to be positioned closely together for compact design.
Solution Approach 2:
Thin film insulation layers are used to separate conductive elements in the compact planar structure. These thin films provide effective electrical isolation while occupying minimal space, enabling reduced volume without compromising reliability against short circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves compact size, high efficiency, and cost-effectiveness by preventing short circuits and allowing for reduced substrate complexity, while maintaining electrical connectivity and insulation.
Implementation Method 1
The primary winding(s) receive electrical energy, such as from a power source, and couples this energy to the secondary winding(s) by a changing magnetic field. The energy appears as an electromagnetic force across the secondary winding(s).
Data Source
AI summary
A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a gap between a bottom surface of the core and the first surface of the substrate, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, and an overmold material encapsulating the core, the spacer, and the wire bonds and filling the gap.