Surface Measurement Probe Thermal Management
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Solution Overview
Problem
High-temperature surface measurement probes face challenges in thermal transmission and measurement accuracy due to differing coefficients of thermal expansion and thermal stresses caused by heat conduction between the probe tip and sample, especially in IR-bath-type heating arrangements.
Innovation Solution
A surface measurement probe design featuring a hollow probe body with a thermally-insulating bead and thermal dissipation element, which minimizes thermal transmission by absorbing and reflecting infrared radiation and redirecting heat through sideways radiation, respectively, while maintaining alignment and stability with a retaining arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a simple thermally-insulating tip holder is used, then heat conduction is minimized, but thermal stresses from IR radiation cause dimensional changes and measurement inaccuracy
Solution Approach 1:
The patent changes the material parameter of the probe body from simple thermally-insulating material to a composite structure with specific thermal conductivity properties. The probe body is designed to have controlled thermal conductivity to manage heat distribution while minimizing thermal stresses that cause dimensional changes.
Solution Approach 2:
The patent employs a composite structure consisting of a probe body made from material with specific thermal conductivity properties, combined with a tip holder and beads. This composite design allows optimization of thermal management by combining materials with different thermal characteristics to achieve both heat insulation and stress reduction.
2Loss of energy
If radiant heat dissipation fins are added to the probe, then heat transmission is reduced, but thermal stresses from cooled block contact limit measurement precision
Solution Approach 1:
The patent removes the radiant heat dissipation fins from the probe design. Instead of adding components that actively dissipate heat and generate thermal stresses, the solution extracts the heat management function to a passive probe body design with optimized thermal conductivity, eliminating the source of thermal stress-induced measurement errors.
Solution Approach 2:
The patent converts the harmful effect of thermal radiation into a beneficial passive heat management system. By designing the probe body with specific thermal conductivity properties, the system naturally manages heat distribution without requiring active dissipation components, thereby eliminating thermal stresses while maintaining heat control.
3Temperature
If the probe body is made longer to accommodate heating arrangements, then heating capability is improved, but the probe becomes flimsy and measurement precision is extremely limited
Solution Approach 1:
The patent changes the structural parameter of the probe body from long and flimsy to short and robust. By optimizing the probe body length and material properties, the design achieves sufficient heating capability without compromising structural integrity, thereby maintaining measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces thermal transmission to the probe's proximal end, minimizing thermal expansion and enhancing measurement accuracy in high-temperature environments up to 1000°C without active heating components, protecting sensitive electronics.
Implementation Method 1
the bead acts as a thermal resistance to transmission of infrared radiation re-radiated inside the distal end of the probe, by means of absorbing and/or reflecting such infrared radiation
Implementation Method 2
the bead acts as a thermal resistance to transmission of infrared radiation re-radiated inside the distal end of the probe, by means of absorbing and/or reflecting such infrared radiation
Implementation Method 3
thermal dissipation element, which minimizes thermal transmission by absorbing and reflecting infrared radiation and redirecting heat through sideways radiation
Implementation Method 4
A surface measurement probe design featuring a hollow probe body with a thermally-insulating bead and thermal dissipation element, which minimizes thermal transmission
Data Source
AI summary
Surface measurement probe comprising:a hollow probe body extending along a longitudinal axis and comprising a proximal end adapted to be mounted to a test apparatus and a distal end;a retaining arrangement situated inside the probe body and extending along said longitudinal axis, the retaining arrangement being arranged to maintain the surface measurement probe in an assembled state;a probe tip supported at the distal end of the probe body and arranged to contact a sample;a bead situated inside the probe body and interposed between the probe tip and the retaining arrangement, the bead comprising a thermally-insulating material.