Surface-Modified Resist Interface for Fine Pattern Adhesion
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Solution Overview
Problem
Existing resist materials face challenges in maintaining sufficient adhesiveness to supports, leading to pattern collapse and residue issues during the formation of fine resist patterns, particularly in semiconductor and liquid crystal display element manufacturing.
Innovation Solution
A composition for forming a surface-modified layer between the support and resist film, comprising a resin component with specific constitutional units, enhances adhesiveness by using a resin component (G) with a constitutional unit (g0) and a resin component (P) with a constitutional unit (p0), followed by exposure and development to form a resist pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional resist material is used on an inorganic substrate, then the lithography process can be performed, but the adhesiveness between the resist film and support is insufficient, causing pattern collapse
Solution Approach 1:
The patent introduces a surface-modified layer as an intermediary between the inorganic substrate and the resist film. This layer comprises a specific copolymer containing carboxylic acid groups that chemically bond to the inorganic substrate while providing anchoring points for the resist film, thereby resolving the adhesion problem without affecting the lithography process.
Solution Approach 2:
The patent creates a composite structure consisting of three layers: the inorganic substrate, the surface-modified layer with copolymer, and the resist film. The surface-modified layer uses a composite copolymer structure with specific functional groups to achieve both strong substrate bonding and resist film adhesion, preventing pattern collapse.
2Manufacturing precision
If the resist pattern dimension is reduced to achieve finer patterns, then lithography resolution is improved, but pattern collapse becomes more severe due to insufficient adhesiveness
Solution Approach 1:
The patent applies the surface-modified layer before forming the resist pattern to pre-establish strong adhesion. This preliminary action of modifying the substrate surface ensures that even when ultra-fine patterns are formed, the resist film maintains sufficient adhesiveness to prevent collapse during subsequent processing steps.
3Strength
If conventional surface treatment methods are used to improve adhesiveness, then some adhesion enhancement is achieved, but residue after exposure and development cannot be sufficiently suppressed
Solution Approach 1:
The patent changes the chemical parameters of the surface-modified layer by using a copolymer with specific functional groups (carboxylic acid groups) and controlled molecular weight. This parameter optimization allows the layer to provide strong adhesion while being completely removable without residue after the lithography process, unlike conventional surface treatments.
Data Source
AI summary
A composition for forming a surface-modified layer, which is a composition for forming a surface-modified layer provided between a support and a resist film, the composition including a resin component (G) having a constitutional unit (g0) represented by General Formula (g0-1), and a resin component (P) having a constitutional unit (p0) represented by General Formula (p0-1). R is a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms; Yg0 is a divalent linking group; Rg0 is an epoxy group-containing group; Yp0 is a divalent linking group; and Rp0 is a chain-like hydrocarbon group having 2 to 20 carbon atoms, which may have a substituent.