Surface-Mount Monolithic Filter With Integrated Heat Sink
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Solution Overview
Problem
Miniaturization of passive components in electric filters leads to reduced power handling capacity, and there is a need for compact filters that can operate at elevated power levels without overheating.
Innovation Solution
A filter assembly with a monolithic filter coupled to a heat sink featuring a layer of thermally conductive material, which enhances heat dissipation and provides electrical shielding, allowing the filter to operate at higher power levels while maintaining performance across a wide temperature range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If miniaturization is applied to passive components in electric filters, then the size of the filter is reduced, but the power handling capacity decreases
Solution Approach 1:
The patent introduces a vertical heat dissipation dimension by coupling the monolithic filter to a heat sink with thermally conductive material layers. This allows heat to be conducted vertically away from the compact filter structure, enabling miniaturization while maintaining power handling capacity through enhanced thermal management in the vertical dimension.
Solution Approach 2:
The heat sink with thermally conductive material layers acts as an intermediary between the monolithic filter and the ambient environment. This intermediary component facilitates efficient heat transfer from the compact filter structure, enabling the filter to maintain high power handling capacity despite its miniaturized size.
2Power
If power handling capacity is increased in compact filters, then elevated power levels can be operated, but heat dissipation becomes more challenging
Solution Approach 1:
The patent changes the thermal parameters of the filter assembly by introducing a heat sink with thermally conductive material layers having specific thermal conductivity values. This parameter change enables the compact filter to dissipate heat effectively at elevated power levels, resolving the contradiction between power handling capacity and heat dissipation challenges.
3Power
If thermal management is enhanced in compact filters, then power handling capacity increases, but device complexity increases
Solution Approach 1:
The patent merges the heat sink with the monolithic filter structure by directly coupling them together. This integration combines the filtering function and heat dissipation function into a single unified assembly, enhancing power handling capacity while minimizing the increase in device complexity through functional integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The filter assembly achieves improved heat dissipation, increased power handling capacity, and consistent performance characteristics, including low insertion loss and excellent rejection of frequencies outside the pass band, while maintaining a compact size and robustness against electrical interference.
Implementation Method 1
a heat sink coupled to the surface of the monolithic filter. The heat sink may include a layer of thermally conductive material that has a thickness that is greater than about 0.02 mm
Data Source
AI summary
A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.