Surface Mount Component Flatness Reflow Mounting
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Solution Overview
Problem
Existing surface mount electronic components face challenges with reflow mounting due to insufficient flatness of protective coatings, leading to suction failures and increased height, which hinders miniaturization and increases production costs.
Innovation Solution
A surface mount electronic component design featuring a dielectric layer with flat external electrodes and metal terminals connected by high-melting-point lead-free solder, optimized to allow reflow mounting without the need for a case member, ensuring flatness and reduced height through a specific terminal configuration and material selection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective coating material is coated on the electronic component, then corrosion protection is improved, but surface flatness deteriorates leading to suction failure
Solution Approach 1:
The patent applies preliminary action by pre-coating the metal terminals with solder before mounting, creating a flat solder layer that compensates for subsequent coating applications. The coating material is applied after the solder layer is formed, ensuring the critical mounting surface remains flat while still providing corrosion protection through the outer coating layer.
Solution Approach 2:
The solder layer acts as an intermediary between the metal terminal and the protective coating material. This intermediate layer provides a flat mounting surface for reliable suction while allowing the outer coating to provide corrosion protection without affecting the flatness of the mounting surface.
2Reliability
If a case member is used to accommodate the electronic component, then structural protection is improved, but component height increases
Solution Approach 1:
The patent extracts and eliminates the case member from the electronic component structure. Instead of using a separate case to accommodate and protect the component, the design relies on the inherent structural integrity of the substrate board and the reinforced metal terminals, achieving structural protection without the additional height imposed by a case.
Solution Approach 2:
The protective functions previously separated into a case member are merged into the substrate board and terminal structure itself. The substrate board provides mechanical support and protection, while the metal terminals provide structural integrity, eliminating the need for a separate case and reducing overall component height.
3Temperature
If lead-free solder with high melting point is used, then heat resistance is improved, but bonding difficulty increases
Solution Approach 1:
The patent applies parameter changes by carefully controlling the melting point of the lead-free solder within a specific range (200°C to 300°C) and adjusting bonding parameters such as temperature, pressure, and time to match the solder's characteristics. This optimization enables reliable bonding with high-melting-point lead-free solder while maintaining ease of manufacture through parameter tuning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable reflow mounting, prevents suction failures, and reduces the height of the electronic component, improving mountability and production efficiency while maintaining bonding strength and heat resistance.
Implementation Method 1
a first bonding portion connected to the first external electrode, a first extending portion connected to the first bonding portion and extending in a direction parallel or substantially parallel to the first main surface with a space from the first main surface
Data Source
AI summary
A surface mount electronic component includes an element including a dielectric layer that includes a first main surface and a second main surface, a first external electrode disposed on the first main surface, a second external electrode disposed on the second main surface, a first metal terminal connected to the first external electrode, a second metal terminal connected to the second external electrode, and an exterior material covering at least a portion of the element, the first and second external electrodes, and the first and second metal terminals. Upper and lower surfaces of the exterior material are flat or substantially flat.